-
公开(公告)号：US12007816B2
公开(公告)日：2024-06-11
申请号：US17852372
申请日：2022-06-29
Applicant: ASUSTeK COMPUTER INC.
Inventor： Dun-Hao Yang , Kuang-Yu Chang , Ming-Fang Tsai
CPC classification number: G06F1/185 , H05K1/0204
Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
-
公开(公告)号：US09210832B2
公开(公告)日：2015-12-08
申请号：US13953742
申请日：2013-07-30
Applicant: ASUSTeK COMPUTER INC.
Inventor： Kuang-Yu Chang , Ing-Jer Chiou
IPC: H05K7/20 , G06F1/20 , H01L23/427
CPC classification number: H05K7/2039 , G06F1/203 , H01L23/4275 , H01L2924/0002 , H05K7/20509 , H01L2924/00
Abstract: A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.
Abstract translation: 提供了应用于电子设备的热缓冲元件。 热缓冲元件包括吸热材料和多个金属颗粒。 吸热材料相对于电子设备的热源设置。 金属颗粒分布在吸热材料中。 本发明解决了电子产品散热不均匀的问题，使得用户感觉更舒适。
-
公开(公告)号：US20230205284A1
公开(公告)日：2023-06-29
申请号：US17852372
申请日：2022-06-29
Applicant: ASUSTeK COMPUTER INC.
Inventor： Dun-Hao Yang , Kuang-Yu Chang , Ming-Fang Tsai
CPC classification number: G06F1/185 , H05K1/0204
Abstract: A heat dissipation module is adapted for a circuit board, which has an M.2 bonding hole. The heat dissipation module includes a supporting bracket and a heat dissipation element. The supporting bracket has a first side and a second side opposite to each other, and an accommodating space, which is located between the first side and the second side, and is adapted for installing an SSD interface card. The first side has a first mounting hole and a second mounting hole. The heat dissipation element is combined to the first side through the first mounting hole. When the SSD interface card is installed in the accommodating space, the SSD interface card and the supporting bracket are combined to the M.2 bonding hole through the second mounting hole so that the second side faces the circuit board.
-
-
Search Results
3
records
(took 0.011 seconds)
