Invention Grant
- Patent Title: Copper-and-titanium-containing composition and production method therefor
- Patent Title (中): 含铜和钛的组合物及其制备方法
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Application No.: US14002276Application Date: 2012-12-17
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Publication No.: US09210939B2Publication Date: 2015-12-15
- Inventor: So Miyaishi , Yasushi Kuroda , Yasuhiro Hosogi , Ding Li
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-281896 20111222; JP2012-121345 20120528; JP2012-175788 20120808
- International Application: PCT/JP2012/082707 WO 20121217
- International Announcement: WO2013/094573 WO 20130627
- Main IPC: A01N59/16
- IPC: A01N59/16 ; A01N59/20 ; B01J23/72 ; B01J37/03 ; B01J21/06 ; B01J35/00 ; A01N55/02 ; A61L9/01 ; B01J27/055 ; B01J27/135 ; B01J27/25 ; B01J31/38 ; B01J27/122
Abstract:
The Cu- and Ti-containing composition of the present invention contains titanium oxide including rutile-crystal-type titanium oxide, and a divalent copper compound, wherein the rutile-crystal-type titanium oxide exhibits the most intense diffraction peak attributed to rutile-type titanium oxide having a full width at half maximum of 0.65° or less, in a Cu—Kα line X-ray diffraction pattern, which is obtained by plotting intensity of diffraction line with respect to diffraction angle 2θ. The composition exhibits excellent anti-viral property under light and in the dark, and excellent organic compound degradability under light.
Public/Granted literature
- US20140294989A1 COPPER-AND-TITANIUM-CONTAINING COMPOSITION AND PRODUCTION METHOD THEREFOR Public/Granted day:2014-10-02
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