Invention Grant
- Patent Title: Capacitive sensing structure with embedded acoustic channels
- Patent Title (中): 具有嵌入声道的电容感测结构
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Application No.: US14092300Application Date: 2013-11-27
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Publication No.: US09216897B2Publication Date: 2015-12-22
- Inventor: Mei-Lin Chan , Xiang Li , Martin Lim
- Applicant: Invensense, Inc.
- Applicant Address: US CA San Jose
- Assignee: INVENSENSE, INC.
- Current Assignee: INVENSENSE, INC.
- Current Assignee Address: US CA San Jose
- Agency: IPxLaw Group LLP
- Agent Maryam Imam
- Main IPC: H01L41/113
- IPC: H01L41/113 ; B81B3/00 ; B81B7/00 ; B81C1/00 ; H04R19/00 ; H01L41/09 ; H04R7/08 ; H04R19/04
Abstract:
A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.
Public/Granted literature
- US20140361388A1 CAPACITIVE SENSING STRUCTURE WITH EMBEDDED ACOUSTIC CHANNELS Public/Granted day:2014-12-11
Information query
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