When forming field-effect transistors, a common problem is the formation of a Schottky barrier at the interface between a metal thin film in the gate electrode and a semiconductor material, typically polysilicon, formed thereupon. Fully silicided gates are known in the state of the art, which may overcome this problem. However, formation of a fully silicided gate is hindered by the fact that silicidation of the source and drain regions and of the gate electrode are normally performed simultaneously. The claimed method proposes two consecutive silicidation processes which are decoupled with respect to each other. During the first silicidation process, a metal silicide is formed forming an interface with the source and drain regions and without affecting the gate electrode. During the second silicidation, a metal silicide layer having an interface with the gate electrode is formed, without affecting the transistor source and drain regions.