Invention Grant
US09230647B2 Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof
有权
用于改善RRAM可靠性的金属线路连接,包括其的半导体布置及其制造
- Patent Title: Metal line connection for improved RRAM reliability, semiconductor arrangement comprising the same, and manufacture thereof
- Patent Title (中): 用于改善RRAM可靠性的金属线路连接,包括其的半导体布置及其制造
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Application No.: US14152244Application Date: 2014-01-10
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Publication No.: US09230647B2Publication Date: 2016-01-05
- Inventor: Chun-Yang Tsai , Yu-Wei Ting , Kuo-Ching Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00 ; H01L27/24

Abstract:
An integrated circuit device includes an array of RRAM cells, an array of bit lines for the array of RRAM cells, and an array of source lines for the array of RRAM cells. Both the source lines and the bit lines are in metal interconnect layers above the RRAM cells. The source line are thereby provided with a higher than conventional wire size, which increases the reset speed by approximately one order of magnitude. The lifetime of the RRAM transistors and the durability of the RRAM device are consequentially improved to a similar degree.
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