发明授权
- 专利标题： Substrate treating apparatus
- 专利标题（中）： 底物处理装置
-
申请号： US13401617申请日： 2012-02-21
-
公开(公告)号： US09230834B2公开(公告)日： 2016-01-05
- 发明人: Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- 申请人： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
- 申请人地址： JP Kyoto
- 专利权人： SCREEN Semiconductor Solutions Co., Ltd.
- 当前专利权人： SCREEN Semiconductor Solutions Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 优先权： JP2007-172496 20070629
- 主分类号： B05D3/12
- IPC分类号： B05D3/12 ; H01L21/677 ; H01L21/67 ; B05C13/00 ; B05D3/04 ; B05B15/12 ; H01L23/34
摘要：
A substrate treating method for treating substrates with a substrate treating apparatus having an indexer section, a treating section and an interface section includes performing resist film forming treatment in parallel on a plurality of stories provided in the treating section and performing developing treatment in parallel on a plurality of stories provided in the treating section.
公开/授权文献
- US20120156380A1 SUBSTRATE TREATING APPARATUS 公开/授权日：2012-06-21
信息查询
