发明授权
- 专利标题: Substrate processing apparatus
- 专利标题(中): 基板加工装置
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申请号: US13824637申请日: 2011-09-21
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公开(公告)号: US09230842B2公开(公告)日: 2016-01-05
- 发明人: Sensho Kobayashi
- 申请人: Sensho Kobayashi
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 代理机构: Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权: JP2010-212490 20100922
- 国际申请: PCT/JP2011/071495 WO 20110921
- 国际公布: WO2012/039426 WO 20120329
- 主分类号: H01L21/677
- IPC分类号: H01L21/677 ; H01L21/67
摘要:
Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.
公开/授权文献
- US20130309045A1 SUBSTRATE PROCESSING APPARATUS 公开/授权日:2013-11-21
信息查询
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