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公开(公告)号：US20140003891A1
公开(公告)日：2014-01-02
申请号：US14004953
申请日：2012-03-23
申请人： Sensho Kobayashi
发明人： Sensho Kobayashi
IPC分类号： H01L21/677
CPC分类号： H01L21/67703 , H01L21/67173 , H01L21/67184 , H01L21/67201
摘要： A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.
摘要翻译： 一种基板处理装置，包括：多个真空转印模块，包括用于在配置成在减压气氛下处理基板的真空转印模块附近布置的多个处理模块之间转印基板的转印机构; 设置在每个真空传递模块的一个或多个装载锁模块; 第一气氛传送机构，其将从外部供给的基板传递到一个负载锁定模块; 以及第二气氛传送机构，其从所述第一大气传送机构接收所述基板，并将所接收的基板传送到另一个负载锁定模块。 第二气氛传送机构设置在设置有一个负载锁定模块的真空传递模块的上方或下方，并且真空传递模块沿着第二大气传送机构的基板传送方向串联布置。
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公开(公告)号：US5788747A
公开(公告)日：1998-08-04
申请号：US788702
申请日：1997-01-24
IPC分类号： C23C16/44 , B01D50/00 , H01L21/205 , H01L21/285
CPC分类号： B01D50/00 , Y10S438/905 , Y10S438/909
摘要： An exhaust system for a film forming apparatus including an exhaust pipe passage connected to an exhaust port of the film forming apparatus for forming a film on a object by using vaporized gas of an organic metal compound. The film forming apparatus includes a pressure transfer unit provided for the exhaust pipe passage and arranged to transfer, through the exhaust pipe passage, gas in the film forming apparatus as exhaust gas. A cooling mechanism is provided for the pressure transfer unit and arranged to cool the pressure transfer unit to a temperature lower than a temperature, at which the organic metal compound is decomposed, so as to prevent precipitation of the organic metal compound contained in the exhaust gas introduced into the pressure transfer unit. A removing unit is disposed at an intermediate position of the exhaust pipe passage, downstream from the pressure transfer unit, so as to remove the organic metal compound contained in the exhaust gas which is introduced through the exhaust pipe passage.
摘要翻译： 一种用于成膜设备的排气系统，包括连接到成膜设备的排气口的排气管通道，用于通过使用有机金属化合物的气化气体在物体上形成膜。 成膜装置包括设置在排气管路上的压力传递单元，其设置成通过排气管道将成膜装置中的气体作为废气传递。 为压力传递单元设置冷却机构，将压力传递单元冷却到低于有机金属化合物分解温度的温度，以防止废气中含有的有机金属化合物析出 引入压力传送单元。 除气单元设置在排气管通道的中间位置，位于压力传送单元的下游，以去除通过排气管通道引入的废气中包含的有机金属化合物。
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公开(公告)号：US09443749B2
公开(公告)日：2016-09-13
申请号：US13980474
申请日：2012-01-18
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67703 , H01L21/67196 , H01L21/67742
摘要： In this vacuum processing apparatus, four process modules and four load-rock modules are arranged in clusters around a two-stage conveyance vacuum chamber. In the apparatus, the entirety of the second stage of the vacuum conveyance chamber is a third vacuum conveyance area and the third vacuum conveyance area extends from the second stage to the first stage through an aperture to enter between first and second vacuum conveyance areas. A third vacuum conveyance robot has: left and right-side conveyance units, which can move straight in the depth direction in the second stage of the third vacuum conveyance area; and left and right-side conveyance units, which can move straight in the vertical direction, i.e. can move up and down, in the aperture of the vacuum conveyance area.
摘要翻译： 在该真空处理装置中，四个处理模块和四个负载 - 岩石模块围绕两级输送真空室排列成簇。 在该装置中，真空输送室的第二阶段的整体是第三真空输送区域，第三真空输送区域从第二阶段延伸到第一阶段通过孔径进入第一和第二真空输送区域之间。 第三真空输送机器人具有：在第三真空输送区域的第二阶段中能够在深度方向上直线移动的左右输送单元; 以及可以在真空输送区域的孔中在垂直方向上直线移动即可上下移动的左右侧输送单元。
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公开(公告)号：US09230842B2
公开(公告)日：2016-01-05
申请号：US13824637
申请日：2011-09-21
申请人： Sensho Kobayashi
发明人： Sensho Kobayashi
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67739 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67745
摘要： Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.
摘要翻译： 公开了一种基板处理装置，包括：容纳部，其构造成容纳基板; 传送室，其包括连接到其周边的多个气密室和设置在其中的传送机构，所述多个气密室中的每一个被构造成在气密状态下处理所述基板，并且所述传送机构被配置为将 衬底与气密室之间; 携带部，被构造成经由设置在所述传送室中的第一开口将所述基板输送到所述传送室; 以及执行部，其被配置为将从设置在与所述传送室的所述第一开口不同的位置的第二开口排出的所述基板执行到所述收纳部，而不将所述基板返回到所述传送室。
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公开(公告)号：US09228685B2
公开(公告)日：2016-01-05
申请号：US13992148
申请日：2011-11-30
申请人： Sensho Kobayashi , Keita Kumagai
发明人： Sensho Kobayashi , Keita Kumagai
CPC分类号： F16L53/00 , C23C16/4408 , H01L21/67109 , H01L21/67201 , Y10T137/6416
摘要： A load lock device includes a vessel of which an internal pressure is variable between a pressure corresponding to a vacuum chamber and an atmospheric pressure; a purge gas supply source configured to supply a purge gas into the vessel; an exhaust device configured to evacuate an inside of the vessel; a pressure controller configured to adjust the internal pressure of the vessel to be the pressure corresponding to the vacuum chamber and the atmospheric pressure; a cooling member within the vessel configured to cool a substrate while the substrate is placed adjacent thereto; a first purge gas discharging member configured to discharge the purge gas to flow in parallel with the substrate while controlling a turbulent flow thereof; and a second purge gas discharging member formed of a porous material and configured to discharge the purge gas toward a bottom surface of the substrate from below the substrate.
摘要翻译： 一种装载锁定装置包括容器，其内部压力在对应于真空室的压力和大气压之间是可变的; 净化气体供应源，其构造成将吹扫气体供应到所述容器中; 构造成排出容器内部的排气装置; 压力控制器，被配置为将所述容器的内部压力调节为与所述真空室对应的压力和所述大气压力; 所述容器内的冷却构件构造成在所述衬底相邻放置时冷却衬底; 第一吹扫气体排出构件，其构造成排出吹扫气体，同时控制其流动; 以及第二吹扫气体排出构件，其由多孔材料形成，并且构造成从衬底的下方朝向衬底的底表面排出吹扫气体。
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公开(公告)号：US09147591B2
公开(公告)日：2015-09-29
申请号：US14004953
申请日：2012-03-23
申请人： Sensho Kobayashi
发明人： Sensho Kobayashi
IPC分类号： H01L21/67 , H01L21/677
CPC分类号： H01L21/67703 , H01L21/67173 , H01L21/67184 , H01L21/67201
摘要： A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.
摘要翻译： 一种基板处理装置，包括：多个真空转印模块，包括用于在配置成在减压气氛下处理基板的真空转印模块附近布置的多个处理模块之间转印基板的转印机构; 设置在每个真空传递模块的一个或多个装载锁模块; 第一气氛传送机构，其将从外部供给的基板传递到一个负载锁定模块; 以及第二气氛传送机构，其从所述第一大气传送机构接收所述基板，并将所接收的基板传送到另一个负载锁定模块。 第二气氛传送机构设置在设置有一个负载锁定模块的真空传递模块的上方或下方，并且真空传递模块沿着第二大气传送机构的基板传送方向串联布置。
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公开(公告)号：US20130248014A1
公开(公告)日：2013-09-26
申请号：US13992148
申请日：2011-11-30
申请人： Sensho Kobayashi , Keita Kumagai
发明人： Sensho Kobayashi , Keita Kumagai
IPC分类号： F16L53/00
CPC分类号： F16L53/00 , C23C16/4408 , H01L21/67109 , H01L21/67201 , Y10T137/6416
摘要： A load lock device includes a vessel of which an internal pressure is variable between a pressure corresponding to a vacuum chamber and an atmospheric pressure; a purge gas supply source configured to supply a purge gas into the vessel; an exhaust device configured to evacuate an inside of the vessel; a pressure controller configured to adjust the internal pressure of the vessel to be the pressure corresponding to the vacuum chamber and the atmospheric pressure; a cooling member within the vessel configured to cool a substrate while the substrate is placed adjacent thereto; a first purge gas discharging member configured to discharge the purge gas to flow in parallel with the substrate while controlling a turbulent flow thereof; and a second purge gas discharging member formed of a porous material and configured to discharge the purge gas toward a bottom surface of the substrate from below the substrate.
摘要翻译： 一种装载锁定装置包括容器，其内部压力在对应于真空室的压力和大气压之间是可变的; 净化气体供应源，其构造成将吹扫气体供应到所述容器中; 构造成排出容器内部的排气装置; 压力控制器，被配置为将所述容器的内部压力调节为与所述真空室对应的压力和所述大气压力; 所述容器内的冷却构件构造成在所述衬底相邻放置时冷却衬底; 第一吹扫气体排出构件，其构造成排出吹扫气体，同时控制其流动; 以及第二吹扫气体排出构件，其由多孔材料形成，并且构造成从衬底的下方朝向衬底的底表面排出吹扫气体。
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公开(公告)号：US20130309045A1
公开(公告)日：2013-11-21
申请号：US13824637
申请日：2011-09-21
申请人： Sensho Kobayashi
发明人： Sensho Kobayashi
IPC分类号： H01L21/677
CPC分类号： H01L21/67739 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67745
摘要： Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.
摘要翻译： 公开了一种基板处理装置，包括：容纳部，其构造成容纳基板; 传送室，其包括连接到其周边的多个气密室和设置在其中的传送机构，所述多个气密室中的每一个被构造成在气密状态下处理所述基板，并且所述传送机构被配置为将 衬底与气密室之间; 携带部，被构造成经由设置在所述传送室中的第一开口将所述基板输送到所述传送室; 以及执行部，其被配置为将从设置在与所述传送室的所述第一开口不同的位置的第二开口排出的所述基板执行到所述收纳部，而不将所述基板返回到所述传送室。
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公开(公告)号：US20130302115A1
公开(公告)日：2013-11-14
申请号：US13980474
申请日：2012-01-18
IPC分类号： H01L21/677
CPC分类号： H01L21/67703 , H01L21/67196 , H01L21/67742
摘要： In this vacuum processing apparatus, four process modules and four load-rock modules are arranged in clusters around a two-stage conveyance vacuum chamber. In the apparatus, the entirety of the second stage of the vacuum conveyance chamber is a third vacuum conveyance area and the third vacuum conveyance area extends from the second stage to the first stage through an aperture to enter between first and second vacuum conveyance areas. A third vacuum conveyance robot has: left and right-side conveyance units, which can move straight in the depth direction in the second stage of the third vacuum conveyance area; and left and right-side conveyance units, which can move straight in the vertical direction, i.e. can move up and down, in the aperture of the vacuum conveyance area.
摘要翻译： 在该真空处理装置中，四个处理模块和四个负载 - 岩石模块围绕两级输送真空室排列成簇。 在该装置中，真空输送室的第二阶段的整体是第三真空输送区域，第三真空输送区域从第二阶段延伸到第一阶段通过孔径进入第一和第二真空输送区域之间。 第三真空输送机器人具有：在第三真空输送区域的第二阶段中能够在深度方向上直线移动的左右输送单元; 以及可以在真空输送区域的孔中在垂直方向上直线移动即可上下移动的左右侧输送单元。
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