Invention Grant
- Patent Title: Electronic device and method for fabricating an electronic device
- Patent Title (中): 用于制造电子设备的电子设备和方法
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Application No.: US14165754Application Date: 2014-01-28
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Publication No.: US09230880B2Publication Date: 2016-01-05
- Inventor: Ralf Otremba , Josef Hoeglauer , Juergen Schredl , Teck Sim Lee , Xaver Schloegel , Klaus Schiess
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technolgies AG
- Current Assignee: Infineon Technolgies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/40 ; H01L21/3105 ; H01L21/56 ; H01L23/31 ; H01L23/00 ; H01L23/367 ; H01L23/433
Abstract:
An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element.
Public/Granted literature
- US20150214133A1 Electronic Device and Method for Fabricating an Electronic Device Public/Granted day:2015-07-30
Information query
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