Invention Grant
US09230939B2 Method for producing image pickup apparatus, method for producing semiconductor apparatus, and joined wafer
有权
用于制造图像拾取装置的方法,用于制造半导体装置的方法和接合的晶片
- Patent Title: Method for producing image pickup apparatus, method for producing semiconductor apparatus, and joined wafer
- Patent Title (中): 用于制造图像拾取装置的方法,用于制造半导体装置的方法和接合的晶片
-
Application No.: US14808054Application Date: 2015-07-24
-
Publication No.: US09230939B2Publication Date: 2016-01-05
- Inventor: Kazuhiro Yoshida , Noriyuki Fujimori , Takatoshi Igarashi
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Brown, P.C.
- Priority: JP2012-123225 20120530
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L25/04 ; H01L25/00

Abstract:
A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.
Public/Granted literature
Information query
IPC分类: