Invention Grant
US09230939B2 Method for producing image pickup apparatus, method for producing semiconductor apparatus, and joined wafer 有权
用于制造图像拾取装置的方法,用于制造半导体装置的方法和接合的晶片

Method for producing image pickup apparatus, method for producing semiconductor apparatus, and joined wafer
Abstract:
A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.
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