公开(公告)号：US11647901B2

公开(公告)日：2023-05-16

申请号：US16662599

申请日：2019-10-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: A61B1/05 ,  A61B1/00 ,  G06T7/00 ,  H01L25/065

CPC classification number: A61B1/051 ,  A61B1/00009 ,  A61B1/00013 ,  A61B1/00096 ,  A61B1/05 ,  G06T7/0012 ,  H01L25/0657 ,  H01L2225/06541

Abstract: An endoscope includes an image pickup apparatus, and the image pickup apparatus includes an imager includes an external electrode, a stacked device, a top electrode on a top surface, and a bottom electrode on a bottom surface, a three-dimensional wiring board having a first zone to which the external electrode is bonded, a second zone to which the top electrode or the bottom electrode is bonded, a third zone to which the top electrode or the bottom electrode is bonded, and a fifth zone arranged on a side surface of the stacked device, wherein the top surface, the bottom surface, and at least two side surfaces of the stacked device are covered with the wiring board.

公开(公告)号：US09230939B2

公开(公告)日：2016-01-05

申请号：US14808054

申请日：2015-07-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L21/00 ,  H01L25/04 ,  H01L25/00

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 用BCB树脂或聚酰亚胺制成的密封件填充多个图像拾取芯片之间的间隙的过程; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US10249672B2

公开(公告)日：2019-04-02

申请号：US14556831

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi ,  Kazuhiro Yoshida

IPC: H01L27/146 ,  H01L25/04 ,  H01L23/31 ,  H01L23/00 ,  H04N5/369

Abstract: An image pickup apparatus includes: an image pickup chip including a light receiving section and electrode pads, on a first main face, and a plurality of connection electrodes, each of which is connected to each of the electrode pads via each of a plurality of through-hole interconnections, on a second main face; a transparent cover glass having a larger plan-view dimension than the image pickup chip; a transparent adhesive layer that bonds the first main face of the image pickup chip and the cover glass; and a sealing member that covers a side face of the image pickup chip and a side face of the adhesive layer, and is made of an insulating material having a same plan-view dimension as the cover glass.

公开(公告)号：US10010338B2

公开(公告)日：2018-07-03

申请号：US15094131

申请日：2016-04-08

Applicant: OLYMPUS CORPORATION

Inventor： Takamitsu Sakamoto ,  Chie Onuma ,  Ken Fujisaki ,  Kiichiro Sawada ,  Kazuhiro Yoshida ,  Satoshi Takekoshi ,  Sohei Ueda ,  Yasuo Tanigami

IPC: A61B17/32 ,  A61B17/00

CPC classification number: A61B17/320068 ,  A61B2017/320072 ,  A61B2217/007

Abstract: In an arthroendoscopical surgical method, a resection target area, which is emphasized by fluorescence with use of a fluorescent agent under excitation light, is identified on a meniscus, and a resection line or an imaginary resection line is drawn. Using an ultrasonic treatment tool and an arthroscope, the resection target area is resected by a probe which generates ultrasonic vibrations, based on the resection line or imaginary resection line under visible-light illumination, and an inclined resection surface is formed.

公开(公告)号：US20180110405A1

公开(公告)日：2018-04-26

申请号：US15848991

申请日：2017-12-20

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: A61B1/05 ,  A61B1/00

CPC classification number: A61B1/05 ,  A61B1/00006 ,  A61B1/00009 ,  A61B1/00096 ,  A61B1/04 ,  A61B1/045 ,  A61B1/0661 ,  G02B23/243 ,  G02B23/2484

Abstract: An image pickup apparatus for endoscope includes: an image pickup optical system; a right angle prism configured to receive light from the image pickup optical system; and an image pickup substrate rectangular in plan view with a thickness equal to or greater than 20 μm and equal to or smaller than 100 μm, in which the right angle prism is adhered to a first main surface 60SA, and a light receiving portion is formed below the right angle prism, wherein a groove is formed on a second main surface of the image pickup substrate, and a direction of the groove is inclined more than 45 degrees relative to a short axis direction.

公开(公告)号：US09240398B2

公开(公告)日：2016-01-19

申请号：US14557157

申请日：2014-12-01

Applicant: OLYMPUS CORPORATION

Inventor： Noriyuki Fujimori ,  Takatoshi Igarashi ,  Kazuhiro Yoshida

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/00 ,  H01L27/146 ,  H01L21/78 ,  H01L21/66 ,  H01L21/786 ,  H01L23/31

CPC classification number: H01L25/50 ,  H01L21/78 ,  H01L21/786 ,  H01L22/10 ,  H01L22/20 ,  H01L23/3121 ,  H01L27/14618 ,  H01L27/14638 ,  H01L27/14687 ,  H01L2224/11 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes processes of: cutting an image pickup chip substrate to fabricate a plurality of image pickup chips; bonding the image pickup chips to a glass wafer via a transparent adhesive layer as well as bonding dummy chips to an outer peripheral region of the glass wafer where the image pickup chips are not bonded to fabricate a joined wafer; filling a sealing member between the image pickup chips and the dummy chips; machining the joined wafer to thin a thickness; and cutting the joined wafer.

Abstract translation: 一种图像拾取装置的制造方法，包括以下处理：切割图像拾取芯片基板以制造多个图像拾取芯片; 通过透明粘合剂层将图像拾取芯片接合到玻璃晶片，以及将虚拟芯片接合到不结合图像拾取芯片的玻璃晶片的外周区域以制造接合的晶片; 在图像拾取芯片和虚拟芯片之间填充密封构件; 加工接合的晶片以使厚度变薄; 并切割接合的晶片。

公开(公告)号：US20150333037A1

公开(公告)日：2015-11-19

申请号：US14808054

申请日：2015-07-24

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida ,  Noriyuki Fujimori ,  Takatoshi Igarashi

IPC: H01L25/04 ,  H01L25/00

CPC classification number: H01L25/042 ,  H01L21/56 ,  H01L21/76898 ,  H01L21/78 ,  H01L22/10 ,  H01L22/20 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an image pickup apparatus includes: a process of fabricating a plurality of image pickup chips by cutting an image pickup chip substrate where light receiving sections and electrode pads are formed; a process of fabricating a joined wafer by bonding the image pickup chips to a glass wafer; a process of filling a gap between the plurality of image pickup chips with a sealing member made of a BCB resin or polyimide; a process of machining the joined wafer to reduce a thickness; a process of forming through-hole vias; a process of forming an insulating layer that covers the image pickup chips; a process of forming through-hole interconnections; a process of forming external connection electrodes, each of which is connected to each of the through-hole interconnections; and a process of cutting the joined wafer.

Abstract translation: 一种用于制造图像拾取装置的方法包括：通过切割形成光接收部分和电极焊盘的图像拾取芯片基板来制造多个图像拾取芯片的处理; 通过将图像拾取芯片接合到玻璃晶片来制造接合晶片的工艺; 用BCB树脂或聚酰亚胺制成的密封件填充多个图像拾取芯片之间的间隙的过程; 加工接合的晶片以减小厚度的过程; 形成通孔过孔的过程; 形成覆盖图像拾取芯片的绝缘层的工艺; 形成通孔互连的过程; 形成外部连接电极的工艺，每个连接电极连接到每个通孔互连件; 以及切割接合的晶片的过程。

公开(公告)号：US11323598B2

公开(公告)日：2022-05-03

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken Yamamoto ,  Takatoshi Igarashi ,  Takuro Suyama ,  Kazuhiro Yoshida ,  Kensuke Suga

IPC: H04N5/225 ,  A61B1/00 ,  A61B1/05 ,  G02B23/24 ,  H01L27/146

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US10524640B2

公开(公告)日：2020-01-07

申请号：US15449627

申请日：2017-03-03

Applicant: OLYMPUS CORPORATION

Inventor： Ken Fujisaki ,  Hiroyuki Araki ,  Kazuhiro Yoshida

IPC: A61B1/00 ,  A61B17/24 ,  A61M1/00 ,  A61B1/015 ,  A61B1/05 ,  A61B1/07 ,  A61B1/233 ,  A61B17/00 ,  A61B17/22 ,  A61B90/00 ,  A61B17/34 ,  A61B90/30

Abstract: An endoscopic treatment instrument includes a guide sheath. The guide sheath includes a second distal end, which has an inside diameter to insert the insertion portion therethrough so that the distal end of the insertion portion is configured to protrude relative to the second distal end. The guide sheath is inserted through the guide pipe so that the second distal end is configured to protrude relative to the first distal end of the guide pipe.

公开(公告)号：US09967486B2

公开(公告)日：2018-05-08

申请号：US14088800

申请日：2013-11-25

Applicant: OLYMPUS CORPORATION

Inventor： Kazuhiro Yoshida

IPC: H04N5/369 ,  A61B1/00 ,  A61B1/05

CPC classification number: H04N5/369 ,  A61B1/00163 ,  A61B1/051

Abstract: An image pickup apparatus includes: a solid-state image pickup device partitioned into a light-receiving portion region that generates an image pickup signal of an optical image, a circuit portion region that processes the image pickup signal and generates a driving signal, and a terminal portion region having terminals for inputting/outputting signals with an external apparatus; and an objective optical portion having an objective lens unit including a unit main body having an objective lens group for forming an optical image and a holding barrel where the unit main body is fixed, and a prism that guides the optical image that passes through the objective lens unit to the light-receiving portion region. The prism of the objective optical portion is disposed on the light-receiving portion region of the substrate, and the holding barrel of the objective lens unit is disposed on the circuit portion region.