Invention Grant
- Patent Title: Trench-gate-type insulated gate bipolar transistor
- Patent Title (中): 沟槽型绝缘栅双极晶体管
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Application No.: US14375895Application Date: 2013-02-18
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Publication No.: US09231090B2Publication Date: 2016-01-05
- Inventor: Yasushi Higuchi , Masakiyo Sumitomo
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2012-46618 20120302
- International Application: PCT/JP2013/000866 WO 20130218
- International Announcement: WO2013/128833 WO 20130906
- Main IPC: H01L29/739
- IPC: H01L29/739 ; H01L29/08 ; H01L29/10 ; H01L29/423

Abstract:
In a trench-gate-type insulated gate bipolar transistor, a current will not flow down to a lower portion of a trench, a high electrical field at the lower portion of the trench is suppressed even if a high voltage is applied, such as at a time of turning off, an increase in on-state resistance and a decrease in breakdown resistance and withstand voltage are suppressed. In the semiconductor device, a plurality of trenches is disposed to reach a rear surface of a drift layer, and a collector layer is disposed at a tip end side in an extended direction of the trenches in a surface layer portion of the drift layer. When a gate electrode is applied with a predetermined voltage, a channel region is formed in a portion of the base layer contacting the trenches, and an electric current flows in the predetermined direction along the trenches.
Public/Granted literature
- US20140339602A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-11-20
Information query
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