Invention Grant
- Patent Title: Heat transfer device for wave soldering
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Application No.: US14102994Application Date: 2013-12-11
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Publication No.: US09232664B2Publication Date: 2016-01-05
- Inventor: Stephen M. Hugo , Matthew S. Kelly
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent L. Jeffrey Kelly; Damion Josephs
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H05K3/34 ; B23K1/08 ; B23K3/06 ; H05K13/04 ; H05K1/02
Abstract:
A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.
Public/Granted literature
- US20140183250A1 HEAT TRANSFER DEVICE FOR WAVE SOLDERING Public/Granted day:2014-07-03
Information query
IPC分类:
