Invention Grant
US09236367B1 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
有权
用于在硅堆叠互连技术（SSIT）产品中跟踪插入器裸片的方法和装置
- Patent Title: Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product
- Patent Title (中): 用于在硅堆叠互连技术（SSIT）产品中跟踪插入器裸片的方法和装置
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Application No.: US14625145Application Date: 2015-02-18
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Publication No.: US09236367B1Publication Date: 2016-01-12
- Inventor: Cinti X. Chen , Myongseob Kim , Xiao-Yu Li , Mohsen H. Mardi
- Applicant: Xilinx, Inc.
- Applicant Address: US CA San Jose
- Assignee: XILINX, INC.
- Current Assignee: XILINX, INC.
- Current Assignee Address: US CA San Jose
- Agent Gerald Chan
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L25/00 ; H01L23/544 ; H01L25/065 ; H01L23/00 ; H01L23/498
Abstract:
An apparatus for a stacked silicon interconnect technology (SSIT) product comprises an interposer die, a plurality of integrated circuit dies, a plurality of active components forming an active connection between the integrated circuit dies and the interposer die, and a plurality of dummy components at the interposer die, the dummy components not forming an active connection between the integrated circuit dies and the interposer die. At least a subset of the dummy components forms a pattern, and the pattern comprises an identifier for the interposer die.
Information query
IPC分类:
