Invention Grant
- Patent Title: Patterning of silicon oxide layers using pulsed laser ablation
- Patent Title (中): 使用脉冲激光烧蚀对氧化硅层进行图案化
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Application No.: US14137172Application Date: 2013-12-20
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Publication No.: US09236510B2Publication Date: 2016-01-12
- Inventor: Mehrdad M. Moslehi , Virendra V. Rana , Pranav Anbalagan , Vivek Saraswat
- Applicant: Solexel, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Solexel, Inc.
- Current Assignee: Solexel, Inc.
- Current Assignee Address: US CA Milpitas
- Agent John Wood
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L31/0236 ; B23K26/06 ; B23K26/073 ; B23K26/36 ; B23K26/40 ; H01L31/068 ; H01L31/18 ; H01L31/056 ; H01L31/0224 ; H01L31/0352 ; H01L31/0445 ; H01L31/0216

Abstract:
A method for making an ablated electrically insulating layer on a semiconductor substrate. A first relatively thin layer of at least an undoped glass or undoped oxide is deposited on a surface of a semiconductor substrate having n-type doping. A first relatively thin semiconductor layer having at least one substance chosen from amorphous semiconductor, nanocrystalline semiconductor, microcrystalline semiconductor, or polycrystalline semiconductor is deposited on the relatively thin layer of at least an undoped glass or undoped oxide. At least a layer of borosilicate glass or borosilicate/undoped glass stack is deposited on the relatively thin semiconductor layer. The at least borosilicate glass or borosilicate/undoped glass stack is selectively ablated with a pulsed laser, and the relatively thin semiconductor layer substantially protects the semiconductor substrate from the pulsed laser.
Public/Granted literature
- US20150140721A1 PATTERNING OF SILICON OXIDE LAYERS USING PULSED LASER ABLATION Public/Granted day:2015-05-21
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