Invention Grant
- Patent Title: Electric field gap device and manufacturing method
- Patent Title (中): 电场间隙装置及制造方法
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Application No.: US14301445Application Date: 2014-06-11
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Publication No.: US09236734B2Publication Date: 2016-01-12
- Inventor: Michael in 't Zandt , Klaus Reimann , Olaf Wunnicke
- Applicant: NXP B.V.
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP13173868 20130626
- Main IPC: H02H9/00
- IPC: H02H9/00 ; H02H9/06 ; H01L23/60 ; H01L27/02 ; H01J9/02 ; H01J9/18

Abstract:
The invention provides a method of forming an electric field gap device, such as a lateral field emission ESD protection structure, in which a cathode layer is formed between dielectric layers. Anode channels are formed and they are lined with a sacrificial dielectric layer. Conductive anode pillars are formed in the anode channels, and then the sacrificial dielectric layer is etched away in the vicinity of the anode pillars. The etching leaves a suspended portion of the cathode layer which defines a lateral gap to an adjacent anode pillar. This portion has a sharp end face defined by the corners of the cathode layer and the lateral gap can be defined accurately as it corresponds to the thickness of the sacrificial dielectric layer.
Public/Granted literature
- US20150002966A1 ELECTRIC FIELD GAP DEVICE AND MANUFACTURING METHOD Public/Granted day:2015-01-01
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