Invention Grant
- Patent Title: Circuit board structure
- Patent Title (中): 电路板结构
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Application No.: US13726405Application Date: 2012-12-24
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Publication No.: US09237643B2Publication Date: 2016-01-12
- Inventor: Tsung-Yuan Chen , Shu-Sheng Chiang , David C. H. Cheng
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: J.C. Patents
- Priority: TW97117556A 20080513
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/04 ; H05K3/10 ; H05K3/46 ; H05K1/11 ; H05K3/42
Abstract:
A circuit board structure including a dielectric layer, a fine circuit pattern and a patterned conductive layer is provided, wherein the fine circuit pattern is embedded in a surface of the dielectric layer, and the patterned conductive layer is disposed on another surface of the dielectric layer and protrudes therefrom.
Public/Granted literature
- US20130105202A1 CIRCUIT BOARD STRUCTURE Public/Granted day:2013-05-02
Information query
