Invention Grant
- Patent Title: FINFET structures with fins recessed beneath the gate
- Patent Title (中): FINFET结构,翅片凹陷在门下
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Application No.: US14083517Application Date: 2013-11-19
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Publication No.: US09246003B2Publication Date: 2016-01-26
- Inventor: Kangguo Cheng , Eric C. Harley , Yue Ke , Ali Khakifirooz , Alexander Reznicek
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor structure may include a semiconductor fin, a gate over the semiconductor fin, a spacer on a sidewall of the gate, an angled recess region in an end of the semiconductor fin beneath the spacer, and a first semiconductor region filling the angled recess. The angled recess may be v-shaped or sigma shaped. The structure may further include a second semiconductor region in contact with the first semiconductor region and the substrate. The structure may be formed by forming a gate above a portion of the semiconductor fin on a substrate, forming a spacer on a sidewall of the gate; removing a portion of the semiconductor fin not covered by the spacer or the gate to expose a sidewall of the fin, etching the sidewall of the fin to form an angled recess region beneath the spacer, and filling the angled recess region with a first epitaxial semiconductor region.
Public/Granted literature
- US20150137193A1 FINFET STRUCTURES WITH FINS RECESSED BENEATH THE GATE Public/Granted day:2015-05-21
Information query
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