发明授权
- 专利标题： Method of manufacturing circuit board and chip package and circuit board manufactured by using the method
- 专利标题（中）： 使用该方法制造电路板和芯片封装和电路板的方法
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申请号： US13924705申请日： 2013-06-24
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公开(公告)号： US09257310B2公开(公告)日： 2016-02-09
- 发明人: Sang-Min Lee
- 申请人： HAESUNG DS CO., LTD.
- 申请人地址： KR Changwon-si
- 专利权人： HAESUNG DS CO., LTD.
- 当前专利权人： HAESUNG DS CO., LTD.
- 当前专利权人地址： KR Changwon-si
- 代理机构： Sughrue Mion, PLLC
- 优先权： KR10-2012-0116744 20121019; KR10-2013-0020670 20130226
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; H05K3/46 ; H01L23/14 ; H01L23/498 ; H01L25/065 ; H05K3/00 ; H01L23/053 ; H01L23/00 ; H01L23/538 ; H05K1/03 ; H05K3/42
摘要：
Provided is a method of manufacturing a circuit board. The method includes: preparing a base substrate including a core layer and a first conductive layer that is formed on at least one surface of the core layer and includes an internal circuit pattern; forming a build-up material to cover the first conductive layer; forming in the build-up material at least one cavity through which the core layer and the first conductive layer are exposed; forming a laminated body by curing the build-up material in which the at least one cavity is formed; and forming a second conductive layer including an external circuit pattern on an outer surface of the laminated body.
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