公开(公告)号：US11854830B2

公开(公告)日：2023-12-26

申请号：US17020009

申请日：2020-09-14

申请人： HAESUNG DS CO., LTD.

发明人： Dong Jin Yoon ,  Sung Il Kang ,  In Seob Bae

IPC分类号： H01L21/48 ,  H01L23/498 ,  C25D5/02 ,  G03F7/16 ,  G03F7/42 ,  H01L23/495

CPC分类号： H01L21/4828 ,  C25D5/022 ,  G03F7/164 ,  G03F7/422 ,  H01L21/4839 ,  H01L23/49582 ,  H01L23/49861

摘要： A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.

公开(公告)号：US11674890B2

公开(公告)日：2023-06-13

申请号：US17407985

申请日：2021-08-20

申请人： HAESUNG DS CO., LTD.

发明人： Jin Woo Lee ,  Byung Moon Lee ,  Jin Kee Hong ,  Jong Woo Kim

IPC分类号： G01N21/17 ,  H05K1/02 ,  G01L9/00 ,  G01K11/26 ,  H05K3/28 ,  H05K1/18

CPC分类号： G01N21/1702 ,  G01K11/265 ,  G01L9/0025 ,  H05K1/0274 ,  G01N2021/1708 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1316

摘要： Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

公开(公告)号：US20230094795A1

公开(公告)日：2023-03-30

申请号：US17818516

申请日：2022-08-09

申请人： HAESUNG DS CO., LTD.

发明人： Yong Nam Kim ,  Jae Hoon Jang

IPC分类号： B65H18/10 ,  B65H23/188 ,  B65H18/12 ,  B65H23/032

摘要： Disclosed in a reel-to-reel surface press apparatus. The reel-to-reel surface press apparatus includes an uncoiler and a recoiler, both transferring a component in a reel-to-reel method, a press disposed between the uncoiler and the recoiler, comprising a press plate pressing the component, and having a plurality of reference holes at an equal pitch along an edge of the press plate, a feeder disposed at the rear of the uncoiler and moving the component, and a controller configured to control the component to be transferred based on at least any one of the plurality of reference holes.

公开(公告)号：US20230080101A1

公开(公告)日：2023-03-16

申请号：US17930112

申请日：2022-09-07

申请人： HAESUNG DS CO., LTD.

发明人： Dong Jin YOON ,  Sung Il KANG ,  In Seob BAE ,  Seok Kyu SEO ,  Dong Young PYEON

IPC分类号： H01L23/12 ,  H01L23/00 ,  H01L21/48 ,  H01L23/053

摘要： Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trench is provided and an upper surface in which a second trench and a third trench are provided, including a circuit pattern and a conductive material; a first resin arranged in the first trench; and a second resin arranged in the second trench and the third trench, wherein the second trench exposes at least a part of the first resin.

公开(公告)号：US20220285251A1

公开(公告)日：2022-09-08

申请号：US17653763

申请日：2022-03-07

申请人： HAESUNG DS CO., LTD.

发明人： Wonbin Kim ,  Sung Il Kang ,  In Seob Bae ,  Dong Jin Yoon

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48

摘要： A semiconductor package substrate and a method of manufacturing the same are provided. The semiconductor package substrate includes: a base layer including a conductive material, having a first surface and a second surface opposite the first surface, and having a first groove or first trench in the first surface and a second groove or second trench in the second surface; a first resin buried in the first groove or first trench in the first surface of the base layer; and a groove in at least one corner of the first surface of the base layer and having a depth based on the first surface is 1/2 or more of a thickness of the base layer.

公开(公告)号：US20210098268A1

公开(公告)日：2021-04-01

申请号：US16854704

申请日：2020-04-21

申请人： HAESUNG DS CO., LTD.

发明人： Dong Young PYEON ,  Sung Il KANG ,  Jong Hoe KU ,  In Seob BAE

IPC分类号： H01L21/48

摘要： According to an embodiment of the disclosure, a method of fabricating a carrier for a wafer level package (WLP) by using a lead frame, wherein the lead frame is fabricated by forming a trench and a post by performing first half etching on an upper surface of a base substrate comprising a conductive material, filling the first-half-etched surface with resin of an insulating material, removing the resin exposed to outside of the trench so that an upper surface of the trench and an upper surface of the resin are at a same level, and performing second half etching on a lower surface of the base substrate, in which a memory chip is attached to the lower surface of the base substrate.

公开(公告)号：US20190057930A1

公开(公告)日：2019-02-21

申请号：US16079965

申请日：2016-11-10

申请人： HAESUNG DS CO., LTD.

发明人： In Seob BAE ,  Sung Il KANG

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48

摘要： A semiconductor package substrate, in which a base substrate having an upper surface and a lower surface and formed of a conductive material is filled with resin formed of an insulating material, includes a die pad formed of the conductive material on the upper surface and a lead arranged on the upper surface by being electrically separated from the die pad and comprising a bonding pad that is a wire bonding area. A protrusion protruding toward the lower surface is formed in a central area of the bonding pad. A central thickness of the bonding pad is greater than a peripheral thickness of the bonding pad.

公开(公告)号：US09299588B2

公开(公告)日：2016-03-29

申请号：US14182783

申请日：2014-02-18

申请人： HAESUNG DS CO., LTD.

发明人： Jeung-Il Kim

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/48247

摘要： There is provided a method of manufacturing a lead frame, the method including: preparing a lead frame raw material; forming openings in the lead frame raw material so that the lead frame material includes: a die pad; a die pad supporting portion supporting the die pad; a rail portion supporting the die pad supporting portion; a lead supporting portion having both ends fixed to the die pad supporting portion; and a plurality of leads having a first end connected to the rail portion and a second end connected to the lead supporting portion; plating the lead frame raw material having the openings with a plating layer; and removing the lead supporting portion.

摘要翻译： 提供一种制造引线框架的方法，该方法包括：制备引线框架原料; 在引线框架原材料中形成开口，使得引线框架材料包括：芯片焊盘; 支撑所述管芯焊盘的管芯焊盘支撑部; 支撑所述管芯焊盘支撑部的轨道部分; 引线支撑部分，其两端固定到管芯焊盘支撑部分; 以及多个引线，其具有连接到所述导轨部分的第一端和连接到所述引线支撑部分的第二端; 用镀层电镀具有开口的引线框架原材料; 并且移除引线支撑部分。

公开(公告)号：US09173300B2

公开(公告)日：2015-10-27

申请号：US13603959

申请日：2012-09-05

申请人： Jeong-Hoon Seol ,  Youn-Kwon Jung ,  Sang-Kun Kim

发明人： Jeong-Hoon Seol ,  Youn-Kwon Jung ,  Sang-Kun Kim

IPC分类号： H05K3/36 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K3/0094 ,  H05K3/427 ,  H05K2201/0959

摘要： A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.

摘要翻译： 提供了制造印刷电路板（PCB）和PCB的方法。 该方法包括：从基板的一个表面侧将树脂填充在形成在基板上的通孔中; 从衬底的另一个表面侧向填充在通孔中的树脂发光预定时间; 以及在所述基板的另一表面上施加另一树脂。

公开(公告)号：US09171789B2

公开(公告)日：2015-10-27

申请号：US13958980

申请日：2013-08-05

申请人： HAESUNG DS CO., LTD.

发明人： Dong-Il Shin ,  In-Seob Bae ,  Se-Chuel Park

IPC分类号： H01L23/495 ,  C25D5/12 ,  C25D5/02 ,  C25D17/00 ,  C25D5/34

CPC分类号： H01L23/49582 ,  C25D5/022 ,  C25D5/12 ,  C25D5/34 ,  C25D17/00 ,  H01L23/49548 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a lead frame including a plurality of plating layers formed on both an upper surface and a lower surface of a base material including a metal, wherein an upper outermost plating layer of an upper part of the lead frame is a silver plating layer including silver, and a lower outermost plating layer of a lower part of the lead frame is a gold plating layer including gold.

摘要翻译： 提供了一种引线框架，其包括形成在包括金属的基材的上表面和下表面上的多个镀层，其中引线框架的上部的最外侧镀层是银镀层，包括 银，并且引线框架的下部的最外面的镀层是包含金的镀金层。