Invention Grant
- Patent Title: Substrate processing and positioning apparatus, substrate processing and positioning method and storage medium recording program for processing and positioning a substrate
- Patent Title (中): 基板处理和定位装置，基板处理和定位方法以及用于处理和定位基板的存储介质记录程序
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Application No.: US13104331Application Date: 2011-05-10
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Publication No.: US09257313B2Publication Date: 2016-02-09
- Inventor: Yoshifumi Amano
- Applicant: Yoshifumi Amano
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2010-110367 20100512; JP2011-058279 20110316
- Main IPC: H01L21/66
- IPC: H01L21/66 ; C23F1/08 ; H01L21/67
Abstract:
Disclosed is a substrate processing apparatus including: a substrate processing unit that performs substrate processing by supplying a processing liquid to a substrate to be processed; a positioning mechanism that contacts the sides of the substrate to determine the position of the substrate; a positioning driver that drives the positioning mechanism; a detector that detects the position of the positioning mechanism; a storage unit that stores the position of the positioning mechanism with respect to a reference substrate serving as a reference of the substrate as a reference position information; and an operator that calculates a difference between the reference position information and the position information of the positioning mechanism detected in the detector and calculates measurement information on the processed substrate based on the difference.
Public/Granted literature
- US20110281376A1 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM RECORDING PROGRAM Public/Granted day:2011-11-17
Information query
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