发明授权
- 专利标题: Forming structures on resistive substrates
- 专利标题(中): 在电阻基板上形成结构
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申请号: US14230206申请日: 2014-03-31
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公开(公告)号: US09257324B2公开(公告)日: 2016-02-09
- 发明人: Alan B. Botula , Renata Camillo-Castillo , James S. Dunn , Jeffrey P. Gambino , Douglas B. Hershberger , Alvin J. Joseph , Robert M. Rassel , Mark E. Stidham
- 申请人: International Business Machines Corporation
- 申请人地址: KY Grand Cayman
- 专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人: GLOBALFOUNDRIES INC.
- 当前专利权人地址: KY Grand Cayman
- 代理机构: Cantor Colburn LLP
- 主分类号: H01L27/04
- IPC分类号: H01L27/04 ; H01L21/762 ; H01L21/8238 ; H01L21/265 ; H01L27/06 ; H01L27/08 ; H01L27/092
摘要:
A substrate includes a first region having a first resistivity, for optimizing a field effect transistor, a second region having a second resistivity, for optimizing an npn subcollector of a bipolar transistor device and triple well, a third region having a third resistivity, with a high resistivity for a passive device, a fourth region, substantially without implantation, to provide low perimeter capacitance for devices.
公开/授权文献
- US20140213036A1 FORMING STRUCTURES ON RESISTIVE SUBSTRATES 公开/授权日:2014-07-31
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