Invention Grant
US09257335B2 Electronic devices utilizing contact pads with protrusions and methods for fabrication
有权
使用具有突起的接触垫的电子装置和用于制造的方法
- Patent Title: Electronic devices utilizing contact pads with protrusions and methods for fabrication
- Patent Title (中): 使用具有突起的接触垫的电子装置和用于制造的方法
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Application No.: US14426302Application Date: 2013-09-04
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Publication No.: US09257335B2Publication Date: 2016-02-09
- Inventor: Erik Vick , Garry Brian Cunningham , Dorota Temple
- Applicant: Research Triangle Institute
- Applicant Address: US NC Research Triangle Park
- Assignee: Research Triangle Institute
- Current Assignee: Research Triangle Institute
- Current Assignee Address: US NC Research Triangle Park
- Agency: Olive Law Group, PLLC
- Agent David P. Gloekler
- International Application: PCT/US2013/058046 WO 20130904
- International Announcement: WO2014/039546 WO 20140313
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/48 ; H01L23/00
Abstract:
An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).
Public/Granted literature
- US20150235898A1 ELECTRONIC DEVICES UTILIZING CONTACT PADS WITH PROTRUSIONS AND METHODS FOR FABRICATION Public/Granted day:2015-08-20
Information query
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