公开(公告)号：US20150235898A1

公开(公告)日：2015-08-20

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。

公开(公告)号：US09257335B2

公开(公告)日：2016-02-09

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。

公开(公告)号：US10264669B2

公开(公告)日：2019-04-16

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

公开(公告)号：US20170064810A1

公开(公告)日：2017-03-02

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/028 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K1/189 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/025

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

Abstract translation: 柔性电子组件包括柔性载流装置，电绝缘柔性基板和嵌入基板中的电子装置。 电子装置面向下安装在载流装置上，使得电子装置的接触侧或部件侧面向载流装置并且位于载流装置和基板之间的界面处。 载流装置，基板和电子装置在界面处是共面的。 该配置使得柔性电子组件具有超薄的厚度，例如几微米的数量级。