公开(公告)号：US20240127954A1

公开(公告)日：2024-04-18

申请号：US18398623

申请日：2023-12-28

Applicant: Research Triangle Institute

Inventor： Kristin Hedgepath Gilchrist ,  Meghan Sarah Hegarty-Craver ,  Dorota Temple ,  Robert Furberg

IPC: G16H50/20 ,  A61B5/00 ,  A61B5/01 ,  A61B5/024 ,  A61B5/11 ,  A61B5/1455 ,  A61B5/28 ,  A61B5/352 ,  G16H10/60

CPC classification number: G16H50/20 ,  A61B5/0022 ,  A61B5/0024 ,  A61B5/01 ,  A61B5/02405 ,  A61B5/1102 ,  A61B5/1118 ,  A61B5/1455 ,  A61B5/28 ,  A61B5/352 ,  A61B5/4266 ,  A61B5/681 ,  A61B5/6823 ,  A61B5/742 ,  G16H10/60 ,  A61B2505/07 ,  A61B2560/045 ,  A61B2560/0462 ,  A61B2562/0219

Abstract: Disclosed herein are systems, methods, and devices of detecting illness in presymptomatic and asymptomatic infected persons using wearable sensor technology. In a first embodiment, a method is implemented on a computing device, the method includes receiving first sensor data associated with the person over a first period of time and applying the first sensor data to a multi-variate detection model. The method further includes receiving second sensor data associated with the person over a second period of time and applying the second sensor data to the multi-variate detection model. Further the method includes determining a probability value of the illness in the person using the multi-variate detection model and transmitting the probability value to a user interface (UI).

公开(公告)号：US10264669B2

公开(公告)日：2019-04-16

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K1/11

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

公开(公告)号：US09881905B2

公开(公告)日：2018-01-30

申请号：US15304858

申请日：2015-04-20

Applicant: Research Triangle Institute

Inventor： Eric Paul Vick ,  Dorota Temple

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/2511 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01022 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.

公开(公告)号：US20170064810A1

公开(公告)日：2017-03-02

申请号：US15141149

申请日：2016-04-28

Applicant: Research Triangle Institute

Inventor： Jay Lewis ,  Dorota Temple ,  Erik Vick ,  Ethan Klem

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/028 ,  H05K1/0206 ,  H05K1/0224 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K1/189 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/10522 ,  H05K2201/10674 ,  H05K2203/025

Abstract: A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

Abstract translation: 柔性电子组件包括柔性载流装置，电绝缘柔性基板和嵌入基板中的电子装置。 电子装置面向下安装在载流装置上，使得电子装置的接触侧或部件侧面向载流装置并且位于载流装置和基板之间的界面处。 载流装置，基板和电子装置在界面处是共面的。 该配置使得柔性电子组件具有超薄的厚度，例如几微米的数量级。

公开(公告)号：US20170030825A1

公开(公告)日：2017-02-02

申请号：US15223346

申请日：2016-07-29

Applicant: Research Triangle Institute

Inventor： Scott Goodwin ,  Mark Roberson ,  John Lewis ,  Dorota Temple

IPC: G01N17/04

CPC classification number: G01N17/04

Abstract: A corrosion sensor system includes one or more corrosion sensors embedded in a coating material such as an anti-corrosion coating material. Each corrosion sensor may include a resonator disposed on a dielectric substrate, and has a resonant frequency in a radio frequency (RF) range or an infrared (IR) range, and is configured for interacting with an RF or IR excitation signal to produce an RF or IR measurement signal. The corrosion sensor system may be applied to an object for which corrosion is to be monitored. A corrosion detection system includes a data acquisition system that transmits the excitation signal to the corrosion sensor, and receives the measurement signal from the corrosion sensor for analysis to determine whether corrosion has occurred.

Abstract translation: 腐蚀传感器系统包括嵌入涂层材料（例如防腐蚀涂层材料）中的一个或多个腐蚀传感器。 每个腐蚀传感器可以包括设置在电介质基板上的谐振器，并且具有射频（RF）范围或红外（IR）范围内的谐振频率，并且被配置为与RF或IR激励信号相互作用以产生RF 或IR测量信号。 腐蚀传感器系统可以应用于要监测腐蚀的物体。 腐蚀检测系统包括数据采集系统，其将激励信号传输到腐蚀传感器，并接收来自腐蚀传感器的测量信号以进行分析，以确定是否发生腐蚀。

公开(公告)号：US20150235898A1

公开(公告)日：2015-08-20

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/48

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。

公开(公告)号：US09257335B2

公开(公告)日：2016-02-09

申请号：US14426302

申请日：2013-09-04

Applicant: Research Triangle Institute

Inventor： Erik Vick ,  Garry Brian Cunningham ,  Dorota Temple

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/00

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0311 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/036 ,  H01L2224/039 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05096 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05676 ,  H01L2224/05684 ,  H01L2224/05687 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/0476 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2224/0239 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/01044 ,  H01L2224/03 ,  H01L2924/00

Abstract: An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).

Abstract translation: 一种电子设备包括：基板，包括正面，背面，前侧和后侧之间的厚度，从前侧延伸到厚度的一部分的一个或多个正面通孔;以及互连件， 背面朝前方; 接触垫，其包括一个或多个延伸穿过相应的前侧通孔并进入所述互连通孔中的突起; 以及通过互连件延伸并与突起接触的互连。