发明授权
- 专利标题: Bolometer and preparation method thereof
- 专利标题(中): 分光光度计及其制备方法
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申请号: US14353020申请日: 2012-07-25
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公开(公告)号: US09258894B2公开(公告)日: 2016-02-09
- 发明人: Jian Cai , Qian Wang , Ziyu Liu , Yang Hu
- 申请人: Jian Cai , Qian Wang , Ziyu Liu , Yang Hu
- 申请人地址: CN Beijing
- 专利权人: Tsinghua University
- 当前专利权人: Tsinghua University
- 当前专利权人地址: CN Beijing
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 优先权: CN201110319208 20111019
- 国际申请: PCT/CN2012/079126 WO 20120725
- 国际公布: WO2013/056582 WO 20130425
- 主分类号: G01J5/20
- IPC分类号: G01J5/20 ; H01L27/14 ; H01L31/00 ; H05K1/11 ; G01J5/02 ; G01J5/00 ; H01L27/144 ; H01L31/02 ; G01J5/10 ; G01J5/24 ; H01L27/146 ; H01L21/683 ; H01L23/48
摘要:
A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element (1) and a readout circuit (2), wherein the infrared detection element (1) is formed on one side of a first substrate (100), and an edge of the infrared detection element (1) is provided with an electrode hole (9), and the readout circuit (2) is formed on one side of a second substrate (200) and the readout circuit (2) has an electrode, the first substrate (100) is formed thereon with a silicon via (8) passing through the first substrate (100) and filed with a conductive material, the electrode hole (9) of the infrared detection element (1) is electrically connected to the electrode of the readout circuit (2) via the conductive material filled in the silicon via (8). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.
公开/授权文献
- US20150021479A1 BOLOMETER AND PREPARATION METHOD THEREOF 公开/授权日:2015-01-22
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