BOLOMETER AND PREPARATION METHOD THEREOF
    1.
    发明申请
    BOLOMETER AND PREPARATION METHOD THEREOF 有权
    BOLOMETER及其制备方法

    公开(公告)号:US20150021479A1

    公开(公告)日:2015-01-22

    申请号:US14353020

    申请日:2012-07-25

    摘要: A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element (1) and a readout circuit (2), wherein the infrared detection element (1) is formed on one side of a first substrate (100), and an edge of the infrared detection element (1) is provided with an electrode hole (9), and the readout circuit (2) is formed on one side of a second substrate (200) and the readout circuit (2) has an electrode, the first substrate (100) is formed thereon with a silicon via (8) passing through the first substrate (100) and filed with a conductive material, the electrode hole (9) of the infrared detection element (1) is electrically connected to the electrode of the readout circuit (2) via the conductive material filled in the silicon via (8). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.

    摘要翻译: 测辐射热谱仪及其制备方法。 测辐射热计包括:红外线检测元件(1)和读出电路(2),其中红外线检测元件(1)形成在第一基板(100)的一侧,红外线检测元件(1)的边缘 )设置有电极孔(9),读出电路(2)形成在第二基板(200)的一侧,读出电路(2)具有电极,第一基板(100)形成在其上 通过硅通孔(8)穿过第一衬底(100)并放置导电材料,红外线检测元件(1)的电极孔(9)经由读出电路(2)的电极经由 填充在硅通孔(8)中的导电材料。 克服了以下缺陷:现有技术中的辐射热测量仪在其制造的读出电路之后需要用合适的化学机械抛光工艺来平坦化硅晶片表面,电路面积大,并且系统集成工艺的要求 很高

    Bolometer and preparation method thereof
    2.
    发明授权
    Bolometer and preparation method thereof 有权
    分光光度计及其制备方法

    公开(公告)号:US09258894B2

    公开(公告)日:2016-02-09

    申请号:US14353020

    申请日:2012-07-25

    摘要: A bolometer and a preparation method thereof. The bolometer includes: an infrared detection element (1) and a readout circuit (2), wherein the infrared detection element (1) is formed on one side of a first substrate (100), and an edge of the infrared detection element (1) is provided with an electrode hole (9), and the readout circuit (2) is formed on one side of a second substrate (200) and the readout circuit (2) has an electrode, the first substrate (100) is formed thereon with a silicon via (8) passing through the first substrate (100) and filed with a conductive material, the electrode hole (9) of the infrared detection element (1) is electrically connected to the electrode of the readout circuit (2) via the conductive material filled in the silicon via (8). The following defects are overcome: bolometers in the prior art need to flatten the silicon wafer surface with a suitable chemical-mechanical polishing process after a readout circuit thereof has been manufactured, the circuit is large in area, and the requirements of the system integration process are high.

    摘要翻译: 测辐射热谱仪及其制备方法。 测辐射热计包括:红外线检测元件(1)和读出电路(2),其中红外线检测元件(1)形成在第一基板(100)的一侧,红外线检测元件(1)的边缘 )设置有电极孔(9),读出电路(2)形成在第二基板(200)的一侧,读出电路(2)具有电极,第一基板(100)形成在其上 通过硅通孔(8)穿过第一衬底(100)并放置导电材料,红外线检测元件(1)的电极孔(9)经由读出电路(2)的电极经由 填充在硅通孔(8)中的导电材料。 克服了以下缺陷:现有技术中的辐射热测量仪在其制造的读出电路之后需要用合适的化学机械抛光工艺来平坦化硅晶片表面,电路面积大,并且系统集成工艺的要求 很高