Invention Grant
- Patent Title: Schottky device and method of manufacture
- Patent Title (中): 肖特基器件及其制造方法
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Application No.: US14181207Application Date: 2014-02-14
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Publication No.: US09263598B2Publication Date: 2016-02-16
- Inventor: Mohammed Tanvir Quddus , Mihir Mudholkar , Mark Griswold , Ali Salih
- Applicant: Semiconductor Components Industries, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Rennie William Dover
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/872 ; H01L29/66 ; H01L29/47

Abstract:
A Schottky device includes a barrier height adjustment layer in a portion of a semiconductor material. In accordance with an embodiment, the Schottky device is formed from a semiconductor material of a first conductivity type which has a barrier height adjustment layer of a second conductivity type that extends from a first major surface of the semiconductor material into the semiconductor material a distance that is less than a zero bias depletion boundary. A Schottky contact is formed in contact with the doped layer.
Public/Granted literature
- US20150236172A1 SCHOTTKY DEVICE AND METHOD OF MANUFACTURE Public/Granted day:2015-08-20
Information query
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