Invention Grant
US09263604B2 Wafer scale image sensor package and optical mechanism including the same
有权
晶圆尺度图像传感器封装和光学机构包括相同
- Patent Title: Wafer scale image sensor package and optical mechanism including the same
- Patent Title (中): 晶圆尺度图像传感器封装和光学机构包括相同
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Application No.: US13675072Application Date: 2012-11-13
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Publication No.: US09263604B2Publication Date: 2016-02-16
- Inventor: Hui-Hsuan Chen , Tien-Chia Liu , Chia-Hsin Yu
- Applicant: PixArt Imaging Inc.
- Applicant Address: TW Hsin-Chu County
- Assignee: PIXART IMAGING INC.
- Current Assignee: PIXART IMAGING INC.
- Current Assignee Address: TW Hsin-Chu County
- Agency: Hauptman Ham, LLP
- Priority: TW100144986A 20111207; TW101120894A 20120611; CN201210302864 20120823
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0232 ; H01L31/0216
Abstract:
There is provided an optical mechanism including a substrate, an image sensor chip, a light source, a blocking member and a securing member. The image sensor chip is attached to the substrate and has an active area. The light source is attached to the substrate. The blocking member covers the image sensor chip and has an opening to expose at least the active area of the image sensor chip. The securing member fits on the blocking member to secure the blocking member to the substrate.
Public/Granted literature
- US20130147000A1 WAFER SCALE IMAGE SENSOR PACKAGE AND OPTICAL MECHANISM INCLUDING THE SAME Public/Granted day:2013-06-13
Information query
IPC分类:
