Wafer scale image sensor package and optical mechanism including the same
    1.
    发明授权
    Wafer scale image sensor package and optical mechanism including the same 有权
    晶圆尺度图像传感器封装和光学机构包括相同

    公开(公告)号:US09263604B2

    公开(公告)日:2016-02-16

    申请号:US13675072

    申请日:2012-11-13

    CPC classification number: H01L31/0232 H01L31/02162 H01L31/02327

    Abstract: There is provided an optical mechanism including a substrate, an image sensor chip, a light source, a blocking member and a securing member. The image sensor chip is attached to the substrate and has an active area. The light source is attached to the substrate. The blocking member covers the image sensor chip and has an opening to expose at least the active area of the image sensor chip. The securing member fits on the blocking member to secure the blocking member to the substrate.

    Abstract translation: 提供了包括基板,图像传感器芯片,光源,阻挡构件和固定构件的光学机构。 图像传感器芯片附接到基板并具有有效面积。 光源附着在基板上。 阻挡构件覆盖图像传感器芯片,并且具有至少暴露图像传感器芯片的有效区域的开口。 固定构件装配在阻挡构件上以将阻挡构件固定到基底上。

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