Invention Grant
US09264832B2 Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
有权
具有保护膜和MEMS麦克风芯片的微机电系统（MEMS）麦克风
- Patent Title: Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level
- Patent Title (中): 具有保护膜和MEMS麦克风芯片的微机电系统（MEMS）麦克风
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Application No.: US14066712Application Date: 2013-10-30
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Publication No.: US09264832B2Publication Date: 2016-02-16
- Inventor: Cheng-Wei Tsai , Chien-Hsing Lee , Jhyy-Cheng Liou
- Applicant: Solid State System Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Solid State System Co., Ltd.
- Current Assignee: Solid State System Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H04R31/00 ; H04R19/00
Abstract:
A method to protect an acoustic port of a microelectromechanical system (MEMS) microphone is provided. The method includes: providing the MEMS microphone; and forming a protection film, on the acoustic port of the MEMS microphone. The protection film has a porous region over the acoustic port to receive an acoustic signal but resist at least an intruding material. The protection film can at least endure a processing temperature of solder flow.
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