Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
- Patent Title (中): 基板加工装置及基板处理方法
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Application No.: US14233496Application Date: 2012-10-16
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Publication No.: US09266153B2Publication Date: 2016-02-23
- Inventor: Shuichi Nagamine , Yusuke Hashimoto
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Minato-Ku
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-Ku
- Agency: Burr & Brown, PLLC
- Priority: JP2011-233159 20111024
- International Application: PCT/JP2012/076734 WO 20121016
- International Announcement: WO2013/061831 WO 20130502
- Main IPC: B08B3/00
- IPC: B08B3/00 ; B08B3/04 ; H01L21/67 ; H01L21/677 ; H01L21/687 ; H01L21/311
Abstract:
A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit configured to rotatably, horizontally support a substrate; and a plate driving unit configured to move the substrate support unit between an immersion position at which the substrate is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit configured to rotate the substrate supported by the substrate support unit, and liquid supply units configured to supply a liquid to the substrate that is being rotated by the rotary drive unit in the separation position.
Public/Granted literature
- US20140290701A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2014-10-02
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