Invention Grant
- Patent Title: Apparatus for controlling the temperature uniformity of a substrate
- Patent Title (中): 用于控制基板的温度均匀性的装置
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Application No.: US12886255Application Date: 2010-09-20
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Publication No.: US09267742B2Publication Date: 2016-02-23
- Inventor: Kallol Bera , Xiaoping Zhou , Douglas A. Buchberger, Jr. , Andrew Nguyen , Hamid Tavassoli , Surajit Kumar , Shahid Rauf
- Applicant: Kallol Bera , Xiaoping Zhou , Douglas A. Buchberger, Jr. , Andrew Nguyen , Hamid Tavassoli , Surajit Kumar , Shahid Rauf
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: F25B29/00
- IPC: F25B29/00 ; F28F3/12 ; F28F13/00

Abstract:
Apparatus for controlling the thermal uniformity of a substrate. In some embodiments, the thermal uniformity of the substrate is controlled to be more uniform. In some embodiments, the thermal uniformity of the substrate is controlled to be non-uniform in a desired pattern. In some embodiments, an apparatus for controlling thermal uniformity of a substrate includes a substrate support having a support surface to support a substrate thereon. A plurality of flow paths having a substantially equivalent fluid conductance are disposed within the substrate support to flow a heat transfer fluid beneath the support surface.
Public/Granted literature
- US20110180243A1 APPARATUS FOR CONTROLLING TEMPERATURE UNIFORMITY OF A SUBSTRATE Public/Granted day:2011-07-28
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