Invention Grant
- Patent Title: Power supply module
- Patent Title (中): 电源模块
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Application No.: US13481887Application Date: 2012-05-28
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Publication No.: US09271398B2Publication Date: 2016-02-23
- Inventor: Da-Jung Chen , Chun-Tiao Liu
- Applicant: Da-Jung Chen , Chun-Tiao Liu
- Applicant Address: TW Hsinchu
- Assignee: CYNTEC Co., Ltd.
- Current Assignee: CYNTEC Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Litron Patent & Trademark Office
- Agent Min-Lee Teng
- Priority: TW97105555A 20080218
- Main IPC: H05K7/18
- IPC: H05K7/18 ; H05K1/18 ; H01L23/64 ; H01L25/16 ; H01F27/02 ; H05K3/34

Abstract:
A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.
Public/Granted literature
- US20120262145A1 POWER-SUPPLY MODULE Public/Granted day:2012-10-18
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