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338 条记录 (耗时 0.027 秒)

    MAGNETIC COMPONENT
    1.
    发明公开
    MAGNETIC COMPONENT 审中-公开

    公开(公告)号：US20240321500A1

    公开(公告)日：2024-09-26

    申请号：US18613126

    申请日：2024-03-22

    申请人： CYNTEC CO., LTD.

    发明人： Yung-Shou Hsu ,  Chien-Lin Chen ,  Shao-Wei Chang ,  Chun-Ying Liao ,  Hsieh-Shen Hsieh ,  Ying-Teng Chang ,  Chia-Hao Yang

    IPC分类号： H01F27/08 ,  H01F27/26 ,  H01F27/30

    CPC分类号： H01F27/08 ,  H01F27/26 ,  H01F27/303

    摘要： A magnetic component includes a core, at least one coil, a first heat dissipating member and a second heat dissipating member. The core includes at least one outer leg and an inner leg. The at least one coil is wound around the inner leg. The first heat dissipating member is disposed on a first side and a top side of the core. The second heat dissipating member is disposed on a second side and the top side of the core. The first heat dissipating member and the second heat dissipating member have a first joint region, a second joint region and a third joint region on the top side. Projections of the first joint region and the second joint region do not overlap with the inner leg. A projection of at least one of the first heat dissipating member and the second heat dissipating member overlaps with the inner leg.

    METHOD FOR PRODUCING SOLID-STATE BATTERY
    2.
    发明公开
    METHOD FOR PRODUCING SOLID-STATE BATTERY 审中-公开

    公开(公告)号：US20240222696A1

    公开(公告)日：2024-07-04

    申请号：US18428780

    申请日：2024-01-31

    申请人： Cyntec Co., Ltd.

    发明人： Chihung Su ,  Wenhsiung Liao

    IPC分类号： H01M10/0562 ,  H01M4/04 ,  H01M50/46

    CPC分类号： H01M10/0562 ,  H01M4/0419 ,  H01M50/46

    摘要： A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.

    MAGNETIC COMPONENT
    7.
    发明公开
    MAGNETIC COMPONENT 审中-公开

    公开(公告)号：US20230223187A1

    公开(公告)日：2023-07-13

    申请号：US17572641

    申请日：2022-01-11

    申请人： CYNTEC CO., LTD.

    发明人： Kun-Ping Chiu ,  Yu-Lin Hsueh

    IPC分类号： H01F27/34 ,  H01F27/32

    CPC分类号： H01F27/346 ,  H01F27/325

    摘要： A magnetic component includes a first core, a second core, an outer bobbin, a first winding, an inner bobbin and a second winding. The outer bobbin is disposed between the first core and the second core. The outer bobbin has a hollow tube portion, a first bottom portion and a first top portion. The first winding is wound around outer side of the hollow tube portion. The inner bobbin is disposed in the hollow tube portion. The inner bobbin has a second bottom portion and a second top portion. The second winding is wound around the inner bobbin. The second bottom portion is exposed to bottom side of the first bottom portion, such that the first bottom portion overlaps the second bottom portion in a height direction of the magnetic component. The second top portion and the second bottom portion abut against inner side of the hollow tube portion.

    CHIP RESISTOR STRUCTURE
    8.
    发明申请
    CHIP RESISTOR STRUCTURE 有权

    公开(公告)号：US20230134039A1

    公开(公告)日：2023-05-04

    申请号：US17517144

    申请日：2021-11-02

    申请人： Cyntec Co., Ltd.

    发明人： Hsiu-Yu Chang ,  Chao-Ting Lin

    IPC分类号： H01C1/142 ,  H01C7/00

    摘要： A chip resistor structure includes a substrate; a pair of first electrodes disposed opposite to each other on a first surface of the substrate at a first interval; a resistance layer disposed between the pair of first electrodes on the first surface; a spacer layer made of a material having a composition different from that of the resistance layer, disposed over the pair of first electrodes; a protective layer overlying the resistance layer; and a plating layer electroplated onto the pair of first electrodes and the spacer layer, and having ends extending beyond the pair of first electrodes terminate at least over the spacer layer. The plating layer may be joined with or spaced from or climb up to the protective layer on or above the spacer layer.

    Ingress-protective mechanism of wire-wound magnetic component
    9.
    发明授权
    Ingress-protective mechanism of wire-wound magnetic component 有权

    公开(公告)号：US11250982B2

    公开(公告)日：2022-02-15

    申请号：US16024497

    申请日：2018-06-29

    申请人： CYNTEC CO., LTD.

    发明人： Yi-Ting Lai ,  Chu-Keng Lin ,  Hsieh-Shen Hsieh

    IPC分类号： H01F27/32 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28

    摘要： A wire-wound magnetic component includes a magnetic core, a coil set, a bobbin, an insulating wrapper, a caulking member and an ingress-protective finishing film. The magnetic core has at least one leg. The coil set is aligned and interacts with the magnetic core for electromagnetic induction, wherein the coil set includes at least one coil. The bobbin includes: a main body having a hollow portion for accommodating the leg of the magnetic core, and winding therearound a conductive wire to form the coil set, wherein the conductive wire has an unwound free end extending from the coil set; a cover plate disposed at an end of the main body and configured as a flange so as to define a winding space for accommodating the coil set; and an ingress-protective structure disposed in the winding space and separating the coil set from the cover plate.

    Electronic module with a magnetic device
    10.
    发明授权
    Electronic module with a magnetic device 有权

    公开(公告)号：US11134570B2

    公开(公告)日：2021-09-28

    申请号：US16248814

    申请日：2019-01-16

    申请人： CYNTEC CO., LTD.

    发明人： Chun Hsien Lu ,  Bau-Ru Lu ,  Kaipeng Chiang

    IPC分类号： H01F27/29 ,  H05K1/18 ,  H01F5/00 ,  H01F27/06

    摘要： An electronic module includes: a lead frame having at least one metal strip and a plurality of metal leads, wherein a magnetic body encapsulates a portion of each of the at least one metal strip with two ends of each of the at least one metal strip not covered by the magnetic body; and a substrate disposed on the lead frame, wherein the substrate is electrically connected to the plurality of metal leads and the at least one metal strip.