Invention Grant
US09272902B2 Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same
有权
电阻加热组合物，使用组合物的加热复合材料，制备加热复合材料的方法，以及使用其的加热装置和定影装置
- Patent Title: Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same
- Patent Title (中): 电阻加热组合物，使用组合物的加热复合材料，制备加热复合材料的方法，以及使用其的加热装置和定影装置
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Application No.: US13565510Application Date: 2012-08-02
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Publication No.: US09272902B2Publication Date: 2016-03-01
- Inventor: Dong-ouk Kim , Dong-earn Kim , Ha-jin Kim , Sung-hoon Park , Min-jong Bae , Yoon-chul Son , Sang-eui Lee , Kun-mo Chu , In-taek Han
- Applicant: Dong-ouk Kim , Dong-earn Kim , Ha-jin Kim , Sung-hoon Park , Min-jong Bae , Yoon-chul Son , Sang-eui Lee , Kun-mo Chu , In-taek Han
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0019166 20120224
- Main IPC: B82Y30/00
- IPC: B82Y30/00 ; G03G13/20 ; G03G15/20 ; B41J2/435 ; H01B1/24 ; H05B3/14 ; H05B3/26
Abstract:
A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
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