-
1.发明申请HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS INCLUDING THE SAME 有权加热复合材料，加热装置和包装机的加热装置公开(公告)号：US20120294659A1
公开(公告)日：2012-11-22
申请号：US13475404
申请日：2012-05-18
Applicant: Sang-eui LEE , In-taek HAN , Yoon-chul SON , Ha-jin KIM , Dong-ouk KIM , Dong-earn KIM , Kun-mo CHU
Inventor： Sang-eui LEE , In-taek HAN , Yoon-chul SON , Ha-jin KIM , Dong-ouk KIM , Dong-earn KIM , Kun-mo CHU
CPC classification number: G03G15/2057 , B32B1/08 , B32B5/08 , B32B27/08 , B82Y30/00 , C09K5/14 , G03G15/2053 , Y10T442/2984
Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
Abstract translation: 一种加热复合材料，包括聚合物基体; 以及碳纳米管结构，其包括彼此连续连接并与聚合物基体一体化的多个碳纳米管。
-
2.发明授权Heating composite, and heating apparatus and fusing apparatus including the same 有权加热复合材料，以及包括该加热装置的加热装置和定影装置公开(公告)号：US09348280B2
公开(公告)日：2016-05-24
申请号：US13475404
申请日：2012-05-18
Applicant: Sang-Eui Lee , In-Taek Han , Yoon-Chul Son , Ha Jin Kim , Dong-Ouk Kim , Dong-Earn Kim , Kun Mo Chu
Inventor： Sang-Eui Lee , In-Taek Han , Yoon-Chul Son , Ha Jin Kim , Dong-Ouk Kim , Dong-Earn Kim , Kun Mo Chu
CPC classification number: G03G15/2057 , B32B1/08 , B32B5/08 , B32B27/08 , B82Y30/00 , C09K5/14 , G03G15/2053 , Y10T442/2984
Abstract: A heating composite, including a polymer matrix; and a carbon nanotube structure including a plurality of carbon nanotubes continuously connected to each other and integrated with the polymer matrix.
Abstract translation: 一种加热复合材料，包括聚合物基体; 以及碳纳米管结构，其包括彼此连续连接并与聚合物基体一体化的多个碳纳米管。
-
3.发明授权Resistance heating composition, heating composite using the composition, method of preparing the heating composite, and heating apparatus and fusing apparatus using the same 有权电阻加热组合物，使用组合物的加热复合材料，制备加热复合材料的方法，以及使用其的加热装置和定影装置公开(公告)号：US09272902B2
公开(公告)日：2016-03-01
申请号：US13565510
申请日：2012-08-02
Applicant: Dong-ouk Kim , Dong-earn Kim , Ha-jin Kim , Sung-hoon Park , Min-jong Bae , Yoon-chul Son , Sang-eui Lee , Kun-mo Chu , In-taek Han
Inventor： Dong-ouk Kim , Dong-earn Kim , Ha-jin Kim , Sung-hoon Park , Min-jong Bae , Yoon-chul Son , Sang-eui Lee , Kun-mo Chu , In-taek Han
CPC classification number: B82Y30/00 , B41J2/435 , G03G13/20 , G03G15/206 , G03G2215/2054 , H01B1/24 , H05B3/14 , H05B3/26 , H05B2214/04
Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
Abstract translation: 一种电阻加热组合物，包括硅乳液颗粒，碳纳米管和水性介质。
-
4.发明申请公开(公告)号：US20120056234A1
公开(公告)日：2012-03-08
申请号：US13213730
申请日：2011-08-19
Applicant: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
Inventor： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Abstract translation: 公开了包括金属玻璃和有机载体的散热材料和包括接合部分中的至少一个的发光二极管封装，其中所述接合部分包括包括金属玻璃的散热材料。
-
公开(公告)号：US09516739B2
公开(公告)日：2016-12-06
申请号：US14547673
申请日：2014-11-19
Applicant: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
Inventor： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
-
Patent Agency Ranking
6.发明授权Heat dissipation material and light emitting diode package including a junction part made of the heat dissipation material 有权散热材料和发光二极管封装，包括由散热材料制成的接合部分公开(公告)号：US09000473B2
公开(公告)日：2015-04-07
申请号：US13213730
申请日：2011-08-19
Applicant: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
Inventor： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Abstract translation: 公开了包括金属玻璃和有机载体的散热材料和包括接合部分中的至少一个的发光二极管封装，其中所述接合部分包括包括金属玻璃的散热材料。
-
7.发明申请RESISTANCE HEATING COMPOSITION, HEATING COMPOSITE USING THE COMPOSITION, METHOD OF PREPARING THE HEATING COMPOSITE, AND HEATING APPARATUS AND FUSING APPARATUS USING THE SAME 有权电阻加热组合物，使用组合物的加热复合物，加热复合材料的制备方法，加热装置和使用该加热装置的加热装置公开(公告)号：US20130222510A1
公开(公告)日：2013-08-29
申请号：US13565510
申请日：2012-08-02
Applicant: Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
Inventor： Dong-ouk KIM , Dong-earn KIM , Ha-Jin KIM , Sung-hoon PARK , Min-jong BAE , Yoon-chul SON , Sang-eui LEE , Kun-mo CHU , In-taek HAN
CPC classification number: B82Y30/00 , B41J2/435 , G03G13/20 , G03G15/206 , G03G2215/2054 , H01B1/24 , H05B3/14 , H05B3/26 , H05B2214/04
Abstract: A resistance heating composition including a silicon emulsion particle, a carbon nanotube, and an aqueous medium.
Abstract translation: 一种电阻加热组合物，包括硅乳液颗粒，碳纳米管和水性介质。
-
8.发明申请RESISTANCE HEATING COMPOSITION AND HEATING COMPOSITE, HEATING APPARATUS, AND FUSING APPARATUS, INCLUDING RESISTANCE HEATING COMPOSITION 审中-公开电阻加热组合物和加热复合材料，加热装置和加热装置，包括电阻加热组合物公开(公告)号：US20120207525A1
公开(公告)日：2012-08-16
申请号：US13372140
申请日：2012-02-13
Applicant: Dong-ouk KIM , Ha-Jin KIM , In-taek HAN , Yoon-chul SON , Sang-soo JEE , Dong-earn KIM , Sang-eui LEE , Kun-mo CHU
Inventor： Dong-ouk KIM , Ha-Jin KIM , In-taek HAN , Yoon-chul SON , Sang-soo JEE , Dong-earn KIM , Sang-eui LEE , Kun-mo CHU
CPC classification number: G03G15/2057 , B82Y30/00 , C09K5/14 , H05B3/145 , H05B2214/04
Abstract: A resistance heating composition including carbon nanotubes, an ionic liquid, and a binder resin.
Abstract translation: 包括碳纳米管，离子液体和粘合剂树脂的电阻加热组合物。
-
9.发明申请公开(公告)号：US20120181004A1
公开(公告)日：2012-07-19
申请号：US13109559
申请日：2011-05-17
Applicant: Yoon Chul SON , Sang Eui LEE , Ha Jin KIM , Dong Ouk KIM , Dong Earn KIM , Kun Mo CHU
Inventor： Yoon Chul SON , Sang Eui LEE , Ha Jin KIM , Dong Ouk KIM , Dong Earn KIM , Kun Mo CHU
IPC: F28F13/18
CPC classification number: F28F17/00 , F28F19/006 , F28F19/04 , F28F2245/04 , F28F2255/20
Abstract: A surface coating layer, in contact with a surface of a base material of a heat exchanger, comprises a plurality of composite layers comprising a first layer contacting a surface of the base material, the first layer comprising a first matrix and a first nanobody, and a second layer contacting a surface of the first layer and having an interface with the air, where the first layer and the second layer each include a different amount by volume of the first nanobody and the second nanobody, respectively.
Abstract translation: 与热交换器的基材的表面接触的表面涂层包括多个复合层，其包括接触基材表面的第一层，第一层包含第一基体和第一纳米体，以及 第二层与第一层的表面接触并且具有与空气的界面，其中第一层和第二层各自分别包含不同量的第一纳米体和第二纳米体。
-
10.发明申请公开(公告)号：US20150069455A1
公开(公告)日：2015-03-12
申请号：US14547673
申请日：2014-11-19
Applicant: Eun Sung LEE , Sang Soo JEE , Kun Mo CHU , Se Yun KIM , Kyu Hyoung LEE , Sang Mock LEE
Inventor： Eun Sung LEE , Sang Soo JEE , Kun Mo CHU , Se Yun KIM , Kyu Hyoung LEE , Sang Mock LEE
CPC classification number: H05K1/0203 , B23K35/26 , C22C45/00 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/644 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/12044 , H05K3/0061 , H05K3/32 , H05K3/3463 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
Abstract translation: 公开了包括金属玻璃和有机载体的散热材料和包括接合部分中的至少一个的发光二极管封装，其中所述接合部分包括包括金属玻璃的散热材料。
-
-
-
-
-
-
-
-
-
Search Results
10
records
(took 0.013 seconds)
