Invention Grant
US09274167B2 Chip-to-chip signal transmission system and chip-to-chip capacitive coupling transmission circuit
有权
芯片到芯片的信号传输系统和芯片到芯片的电容耦合传输电路
- Patent Title: Chip-to-chip signal transmission system and chip-to-chip capacitive coupling transmission circuit
- Patent Title (中): 芯片到芯片的信号传输系统和芯片到芯片的电容耦合传输电路
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Application No.: US13904032Application Date: 2013-05-29
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Publication No.: US09274167B2Publication Date: 2016-03-01
- Inventor: Yu-Jung Huang , Ming-Kun Chen , Kai-Jen Liu
- Applicant: I-SHOU UNIVERSITY
- Applicant Address: TW Kaohsiung
- Assignee: I-SHOU UNIVERSITY
- Current Assignee: I-SHOU UNIVERSITY
- Current Assignee Address: TW Kaohsiung
- Agency: Jianq Chyun IP Office
- Priority: TW102102997A 20130125
- Main IPC: G01R31/312
- IPC: G01R31/312 ; H04B5/00 ; H04B17/14
Abstract:
A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.
Public/Granted literature
- US20140210496A1 CHIP-TO-CHIP SIGNAL TRANSMISSION SYSTEM AND CHIP-TO-CHIP CAPACITIVE COUPLING TRANSMISSION CIRCUIT Public/Granted day:2014-07-31
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