公开(公告)号：US09274167B2

公开(公告)日：2016-03-01

申请号：US13904032

申请日：2013-05-29

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Ming-Kun Chen ,  Kai-Jen Liu

IPC: G01R31/312 ,  H04B5/00 ,  H04B17/14

CPC classification number: G01R31/312 ,  H04B5/0012 ,  H04B17/14

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Abstract translation: 提供了一种芯片到芯片的信号传输系统，其包括第一芯片，第二芯片和电介质层。 在第一芯片的发射机和第二芯片的接收机之间通过传输金属焊盘单元和接收金属焊盘单元进行信号传输。 当发射机接收到驱动测试信号时，发射机根据驱动测试信号通过传输 - 金属 - 焊盘单元传输传输测试耦合信号。 第一测试单元接收传输测试耦合信号，并根据传输测试耦合信号输出传输测试信号。 第二测试单元，当第二测试单元接收到驱动测试信号时，根据驱动测试信号，通过接收金属焊盘单元发送接收测试耦合信号。 接收器接收接收测试耦合信号，并根据接收测试耦合信号输出接收测试信号。

公开(公告)号：US20140210496A1

公开(公告)日：2014-07-31

申请号：US13904032

申请日：2013-05-29

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Ming-Kun Chen ,  Kai-Jen Liu

IPC: G01R31/02

CPC classification number: G01R31/312 ,  H04B5/0012 ,  H04B17/14

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Abstract translation: 提供了一种芯片到芯片的信号传输系统，其包括第一芯片，第二芯片和电介质层。 在第一芯片的发射机和第二芯片的接收机之间通过传输金属焊盘单元和接收金属焊盘单元进行信号传输。 当发射机接收到驱动测试信号时，发射机根据驱动测试信号通过传输 - 金属 - 焊盘单元传输传输测试耦合信号。 第一测试单元接收传输测试耦合信号，并根据传输测试耦合信号输出传输测试信号。 当第二测试单元接收到驱动测试信号时，第二测试单元根据驱动测试信号通过接收金属焊盘单元发送接收测试耦合信号。 接收器接收接收测试耦合信号，并根据接收测试耦合信号输出接收测试信号。