公开(公告)号：US09274167B2

公开(公告)日：2016-03-01

申请号：US13904032

申请日：2013-05-29

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Ming-Kun Chen ,  Kai-Jen Liu

IPC: G01R31/312 ,  H04B5/00 ,  H04B17/14

CPC classification number: G01R31/312 ,  H04B5/0012 ,  H04B17/14

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Abstract translation: 提供了一种芯片到芯片的信号传输系统，其包括第一芯片，第二芯片和电介质层。 在第一芯片的发射机和第二芯片的接收机之间通过传输金属焊盘单元和接收金属焊盘单元进行信号传输。 当发射机接收到驱动测试信号时，发射机根据驱动测试信号通过传输 - 金属 - 焊盘单元传输传输测试耦合信号。 第一测试单元接收传输测试耦合信号，并根据传输测试耦合信号输出传输测试信号。 第二测试单元，当第二测试单元接收到驱动测试信号时，根据驱动测试信号，通过接收金属焊盘单元发送接收测试耦合信号。 接收器接收接收测试耦合信号，并根据接收测试耦合信号输出接收测试信号。

公开(公告)号：US20150010092A1

公开(公告)日：2015-01-08

申请号：US14053612

申请日：2013-10-15

Applicant: I-SHOU UNIVERSITY

Inventor： Chun-Wei Huang ,  Yu-Jung Huang ,  Ming-Kun Chen

IPC: H04B5/00

CPC classification number: H04B5/0075 ,  H04B5/0031

Abstract: A signal transmission system and a signal transmission circuit are provided. The system includes a first chip and a second chip. A rising pulse signal (RPS) and a falling pulse signal (FPS) are generated by a transmission module on the first chip in response to a waveform of an input signal. The RPS corresponds to rising edges of the input signal, the FPS corresponds to falling edges of the input signal, and the RPS and the FPS are transmitted by a first transmission unit and a second transmission unit both located on a surface of the first

Abstract translation: 提供信号传输系统和信号传输电路。 该系统包括第一芯片和第二芯片。 响应于输入信号的波形，由第一芯片上的传输模块产生上升脉冲信号（RPS）和下降脉冲信号（FPS）。 RPS对应于输入信号的上升沿，FPS对应于输入信号的下降沿，并且RPS和FPS由第一传输单元和第二传输单元传送，第一传输单元和第二传输单元都位于第一

公开(公告)号：US08913687B1

公开(公告)日：2014-12-16

申请号：US14053612

申请日：2013-10-15

Applicant: I-Shou University

Inventor： Chun-Wei Huang ,  Yu-Jung Huang ,  Ming-Kun Chen

IPC: H04L27/00 ,  H04B5/00

CPC classification number: H04B5/0075 ,  H04B5/0031

Abstract: A signal transmission system and a signal transmission circuit are provided. The system includes a first chip and a second chip. A rising pulse signal (RPS) and a falling pulse signal (FPS) are generated by a transmission module on the first chip in response to a waveform of an input signal. The RPS corresponds to rising edges of the input signal, the FPS corresponds to falling edges of the input signal, and the RPS and the FPS are transmitted by a first transmission unit and a second transmission unit both located on a surface of the first chip.

Abstract translation: 提供信号传输系统和信号传输电路。 该系统包括第一芯片和第二芯片。 响应于输入信号的波形，由第一芯片上的传输模块产生上升脉冲信号（RPS）和下降脉冲信号（FPS）。 RPS对应于输入信号的上升沿，FPS对应于输入信号的下降沿，RPS和FPS由位于第一芯片的表面上的第一传输单元和第二传输单元传输。

公开(公告)号：US20140210496A1

公开(公告)日：2014-07-31

申请号：US13904032

申请日：2013-05-29

Applicant: I-SHOU UNIVERSITY

Inventor： Yu-Jung Huang ,  Ming-Kun Chen ,  Kai-Jen Liu

IPC: G01R31/02

CPC classification number: G01R31/312 ,  H04B5/0012 ,  H04B17/14

Abstract: A chip-to-chip signal transmission system is provided, which includes a first chip, a second chip, and a dielectric layer. A signal transmission is performed between a transmitter of the first chip and a receiver of the second chip through a transmission-metal-pad unit and a receiving-metal-pad unit. The transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad unit according to a driving-testing signal when the transmitter receives the driving-testing signal. A first testing unit receives the transmission-testing-coupling signal and outputs a transmission-testing signal according to the transmission-testing-coupling signal. A second testing unit transmits a receiving-testing-coupling signal through the receiving-metal-pad unit according to the driving-testing signal when the second testing unit receives the driving-testing signal. The receiver receives the receiving-testing-coupling signal and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

Abstract translation: 提供了一种芯片到芯片的信号传输系统，其包括第一芯片，第二芯片和电介质层。 在第一芯片的发射机和第二芯片的接收机之间通过传输金属焊盘单元和接收金属焊盘单元进行信号传输。 当发射机接收到驱动测试信号时，发射机根据驱动测试信号通过传输 - 金属 - 焊盘单元传输传输测试耦合信号。 第一测试单元接收传输测试耦合信号，并根据传输测试耦合信号输出传输测试信号。 当第二测试单元接收到驱动测试信号时，第二测试单元根据驱动测试信号通过接收金属焊盘单元发送接收测试耦合信号。 接收器接收接收测试耦合信号，并根据接收测试耦合信号输出接收测试信号。