公开(公告)号：US20180285493A1

公开(公告)日：2018-10-04

申请号：US15604671

申请日：2017-05-25

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Chung-Long Pan ,  Shih-Chun Lin ,  Mei-Hui Guo

IPC分类号： G06F17/50 ,  G06N99/00

CPC分类号： G06F17/5009 ,  G06F17/5081 ,  G06N99/005

摘要： A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US10063282B1

公开(公告)日：2018-08-28

申请号：US15657209

申请日：2017-07-24

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Mei-Hui Guo

IPC分类号： H04B5/00

CPC分类号： H04B5/0012 ,  H04B5/0031

摘要： A chip-to-chip signal transmission system including a first unit set and a second unit set arranged in a first direction is provided. The first unit set and the second unit are configured to perform the signal transmission between a first chip and a second chip. There is a shift between the first unit set and the second unit set in a second direction such that the first unit set and the second unit set are shifted in the second direction and an overlapping region is formed. By adjusting the size of the overlapping region, the signal noise and the signal attenuation due to the misalignment between the first chip and the second chip or the electromagnetic interference of the adjacent signals are reduced and the signal transmission quality is thus improved. Furthermore, a method for arranging chips is also provided.

公开(公告)号：US20220027713A1

公开(公告)日：2022-01-27

申请号：US16986273

申请日：2020-08-06

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Shao-I Chu ,  Meng-Jhe Li ,  Wun-Siou Jhong

IPC分类号： G06N3/063 ,  G06N3/04

摘要： A multi-function calculator suitable for a neural network architecture is provided. The multi-function calculator includes a plurality of activation function operation circuits and a demultiplexer (DMUX). The plurality of activation function operation circuits are configured to execute a plurality of different activation functions on an input signal respectively. The DMUX is coupled to the plurality of activation function operation circuits. The DMUX is configured to receive an enable signal and a selection signal. The DMUX in an enabled state selects one of the plurality of activation function operation circuits to be enabled according to the selection signal. The enabled activation function operation circuit executes a corresponding activation function on the input signal to generate a corresponding output signal.

公开(公告)号：US20180198538A1

公开(公告)日：2018-07-12

申请号：US15451429

申请日：2017-03-07

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Yan-Cen Liou

IPC分类号： H04B17/14 ,  H04B5/00 ,  G01R31/28

摘要： The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal. The receiver receives the receiving-testing-coupling signal through the reception-metal-pad and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

公开(公告)号：US09060265B2

公开(公告)日：2015-06-16

申请号：US13761144

申请日：2013-02-06

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Hsuan-Hsun Wu

IPC分类号： H04K1/00 ,  H04W12/02 ,  G06F19/00 ,  H04L9/08 ,  G06F17/00 ,  H04L29/06 ,  G06F17/30 ,  H04W4/00 ,  H04L29/08

CPC分类号： H04W12/04 ,  G06F19/00 ,  H04L9/0863 ,  H04L9/0869 ,  H04L9/0891 ,  H04L67/12 ,  H04L2209/805 ,  H04W4/70 ,  H04W12/02 ,  H04W12/06 ,  H04W84/18

摘要： The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

摘要翻译： 本发明涉及无线传感器网络系统。 所述无线传感器网络系统适用于药物信息安全环境，所述无线传感器网络系统包括第一传感器节点，第二传感器节点和中心节点。 第一传感器节点发送注册请求和用户标识。 当接收到注册请求和用户标识时，中心节点生成并存储第一组随机数和第二组随机数。 中央节点分别将第一组随机数和第二组随机数发送给第一传感器节点和第二传感器节点。

公开(公告)号：US10776559B2

公开(公告)日：2020-09-15

申请号：US16383683

申请日：2019-04-15

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Chung-Long Pan ,  Mei-Hui Guo

IPC分类号： G06F30/398 ,  G06F11/263 ,  G06F11/22 ,  G06N20/00

摘要： A defect detection method for a multilayer daisy chain structure, including: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a daisy chain structure; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that the multilayer daisy chain has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US10422831B2

公开(公告)日：2019-09-24

申请号：US15451429

申请日：2017-03-07

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Yan-Cen Liou

IPC分类号： G01R31/28 ,  H04B5/00

摘要： The present invention provides a chip-to-chip signal transmission system. Signal transmission is performed between a transmitter of a first chip and a receiver of a second chip through a transmission-metal-pad and a reception-metal-pad. When receiving a driving-testing signal, the transmitter transmits a transmission-testing-coupling signal through the transmission-metal-pad according to the driving-testing signal. A receiving-testing circuit on the first chip receives the transmission-testing-coupling signal through the transmission-testing-metal-pad, and outputs a transmission-testing signal according to the transmission-testing-coupling signal. When receiving the driving-testing signal, a driving-testing circuit on the second chip transmits a receiving-testing-coupling signal through a reception-testing-metal-pad according to the driving-testing signal. The receiver receives the receiving-testing-coupling signal through the reception-metal-pad and outputs a receiving-testing signal according to the receiving-testing-coupling signal.

公开(公告)号：US10303823B2

公开(公告)日：2019-05-28

申请号：US15604671

申请日：2017-05-25

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Chung-Long Pan ,  Shih-Chun Lin ,  Mei-Hui Guo

IPC分类号： G06F17/50 ,  G06N20/00

摘要： A defect detection method for a 3D chip and a system using the same are provided. The method includes: generating a plurality of physical models having a defect of at least one defect type based on the at least one defect type of a 3D chip; generating a group of training samples for each of the physical models; generating a classifier model by using a machine learning technique algorithm via scattering parameter values of a training set; measuring an error value by comparing scattering parameter values of a testing set with the classifier model, using the classifier model as a defect model of the defect type based on the error value, and determining that a Through Silicon Via of a single die 3D chip or a stacked die 3D chip has a defect corresponding to the at least one defect type by comparing actual measurements of scattering parameter values.

公开(公告)号：US09374706B2

公开(公告)日：2016-06-21

申请号：US14708309

申请日：2015-05-11

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Hsuan-Hsun Wu

IPC分类号： H04K1/00 ,  H04W12/04 ,  H04W12/02 ,  G06F19/00 ,  H04L9/08 ,  G06F17/00 ,  H04L29/06 ,  H04W4/00 ,  H04L29/08 ,  H04W12/06 ,  H04W84/18

CPC分类号： H04W12/04 ,  G06F19/00 ,  H04L9/0863 ,  H04L9/0869 ,  H04L9/0891 ,  H04L67/12 ,  H04L2209/805 ,  H04W4/70 ,  H04W12/02 ,  H04W12/06 ,  H04W84/18

摘要： The invention is directed to a wireless sensor network system. The wireless sensor network system is adapted for a medication information security environment, and the wireless sensor network system comprising a first sensor node, a second sensor node and a central node. The first sensor node sends a request for registration and a user identification. The central node generates and stores a first set of random number and a second set of random number when receiving the request for registration and the user identification. The central node sends the first set of random number and the second set of random number to the first sensor node and the second sensor node respectively.

公开(公告)号：US20170170099A1

公开(公告)日：2017-06-15

申请号：US14983574

申请日：2015-12-30

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Wei-Han Huang

IPC分类号： H01L23/498 ,  H01L21/027 ,  H01L21/48

CPC分类号： H01L23/4985 ,  H01L21/0273 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894

摘要： An interposer structure and a manufacturing method thereof are provided. The interposer structure includes a flexible substrate, a plurality of conductive pillars, a first patterned conductive layer, and a second patterned conductive layer. The flexible substrate includes a first surface and a second surface opposite to the first surface and has a plurality of through holes extending from the first surface to the second surface. A material of the flexible substrate is an insulator. The conductive pillars are disposed in the through holes. The first patterned conductive layer is disposed on the first surface of the flexible substrate and is electrically connected to the conductive pillars. The second patterned conductive layer is disposed on the second surface of the flexible substrate and is electrically connected to the conductive pillars.