Invention Grant
- Patent Title: Three dimensional cross-access dual-port bit cell design
- Patent Title (中): 三维交叉访问双端口位单元设计
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Application No.: US14014431Application Date: 2013-08-30
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Publication No.: US09275710B2Publication Date: 2016-03-01
- Inventor: Wei Min Chan , Kao-Cheng Lin , Yen-Huei Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G11C8/16
- IPC: G11C8/16 ; G11C11/41 ; G11C8/14 ; G11C8/08 ; G11C11/412 ; G11C11/413 ; G11C11/417 ; G11C5/06

Abstract:
A semiconductor memory comprises a dual-port memory array having a plurality of cross-access dual-port bit cells arranged in a plurality of rows and a plurality of columns, wherein each of the plurality of cross-access dual-port bit cells has two cross-access ports for read and write of one or more bits of data to the cross-access dual port bit cell. The semiconductor memory further comprises a pair of word lines associated with at least one of the plurality of rows of the dual-port memory array, wherein the pair of word lines is configured to carry a pair of row selection signals for enabling one or more read and write operations on one or more cross-access dual-port bit cells in the row. The semiconductor memory further comprises a pair of column selection lines associated with at least one of the plurality of columns of the dual port memory array, wherein the pair of column selection lines is configured to carry a pair of column selection signals for enabling the cross-access dual-port bit cells in the column during the read and write operations.
Public/Granted literature
- US20150063040A1 THREE DIMENSIONAL CROSS-ACCESS DUAL-PORT BIT CELL DESIGN Public/Granted day:2015-03-05
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