Invention Grant
US09275969B2 Optical interconnect on bumpless build-up layer package 有权
无连接堆叠层封装上的光互连

Optical interconnect on bumpless build-up layer package
Abstract:
This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.
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