Invention Grant
- Patent Title: Optical interconnect on bumpless build-up layer package
- Patent Title (中): 无连接堆叠层封装上的光互连
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Application No.: US13717185Application Date: 2012-12-17
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Publication No.: US09275969B2Publication Date: 2016-03-01
- Inventor: Feras Eid , Johanna Swan , Weng Hong Teh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L31/12 ; H01L23/00 ; H01L25/16 ; H01S5/022 ; H01S5/183

Abstract:
This disclosure relates generally to an electronic package that can include a die and a dielectric layer at least partially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the dielectric layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic package different from the first major surface.
Public/Granted literature
- US20140169800A1 OPTICAL INTERCONNECT ON BUMPLESS BUILD-UP LAYER PACKAGE Public/Granted day:2014-06-19
Information query
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