Invention Grant
US09275995B2 Semiconductor devices having composite spacers containing different dielectric materials
有权
具有包含不同介电材料的复合间隔物的半导体器件
- Patent Title: Semiconductor devices having composite spacers containing different dielectric materials
- Patent Title (中): 具有包含不同介电材料的复合间隔物的半导体器件
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Application No.: US14543140Application Date: 2014-11-17
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Publication No.: US09275995B2Publication Date: 2016-03-01
- Inventor: Jin-Bum Kim , Bon-Young Koo , Seok-Hoon Kim , Chul Kim , Kwan-Heum Lee , Byeong-Chan Lee , Su-Jin Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2013-0150856 20131205
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/161 ; H01L29/06 ; H01L29/66 ; H01L29/78

Abstract:
An integrated circuit device includes an electrically conductive pattern on a substrate. This electrically conductive pattern may be a gate pattern of a field effect transistor. A first electrically insulating spacer is provided on a sidewall of the electrically conductive pattern. The first electrically insulating spacer includes a first lower spacer and a first upper spacer, which extends on the first lower spacer and has a side surface vertically aligned with a corresponding side surface of the first lower spacer. The first upper spacer has a greater dielectric constant relative to a dielectric constant of the first lower spacer. A pair of parallel channel regions may also be provided, which protrude from a surface of the substrate. The electrically conductive pattern may surround top and side surfaces of the pair of parallel channel regions.
Public/Granted literature
- US20150162332A1 SEMICONDUCTOR DEVICES HAVING COMPOSITE SPACERS CONTAINING DIFFERENT DIELECTRIC MATERIALS Public/Granted day:2015-06-11
Information query
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