Invention Grant
- Patent Title: Semiconductor structure and method for manufacturing the same
- Patent Title (中): 半导体结构及其制造方法
-
Application No.: US14387143Application Date: 2012-04-26
-
Publication No.: US09276085B2Publication Date: 2016-03-01
- Inventor: Huaxiang Yin , Xiaolong Ma , Changliang Qi , Qiuxia Xu , Dapeng Chen
- Applicant: Huaxiang Yin , Xiaolong Ma , Changliang Qi , Qiuxia Xu , Dapeng Chen
- Applicant Address: CN Beijing
- Assignee: Institute of Microelectronics Chinese Academy of Sciences
- Current Assignee: Institute of Microelectronics Chinese Academy of Sciences
- Current Assignee Address: CN Beijing
- Agency: Fay Kaplun & Marcin, LLP
- Priority: CN201210080996 20120323
- International Application: PCT/CN2012/074776 WO 20120426
- International Announcement: WO2013/139064 WO 20130926
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/332 ; H01L29/66 ; H01L29/78

Abstract:
The present invention provides a semiconductor structure comprising a substrate; a gate stack on the substrate; a spacer on the sidewalls of the gate stack; a source/drain junction extension formed in the substrate on both sides of the gate stack by epitaxial growth; and a source/drain region in the substrate on both sides of the source/drain junction extension. Accordingly, the present invention also provides methods for manufacturing the semiconductor structure. The present invention can provide a source/drain junction extension with a high doping concentration and a low junction depth, thereby effectively improving the performance of the semiconductor structure.
Public/Granted literature
- US20150115374A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-04-30
Information query
IPC分类: