Abstract:
The present invention discloses a semiconductor device, which comprises a substrate, a gate stack structure on the substrate, a channel region in the substrate under the gate stack structure, and source and drain regions at both sides of the channel region, wherein there is a stressed layer under and at both sides of the channel region, in which the source and drain regions are formed. According to the semiconductor device and the method for manufacturing the same of the present invention, a stressed layer is formed at both sides of and under the channel region made of a silicon-based material so as to act on the channel region, thereby effectively increasing the carrier mobility of the channel region and improving the device performance.
Abstract:
A liquid crystal medium composition of liquid crystal display includes: a negative liquid crystal material, reactive monomer, an initiator, and a stabilizer. The initiator functions to induce photo polymerization of the reactive monomer. The initiator has a molecular structure comprising aromatic rings, carbonyl groups connected to the aromatic rings, and substituted moieties connected to the aromatic rings. The initiator lowers the activation energy of chain initiation reaction of the polymerization of reactive monomer to allow the photo polymerization of the reactive monomer to take place in a wider wavelength range of 200-450 nm, so as to reduce the required intensity and luminance of ultraviolet light and to speed up the reaction of the reactive monomers and also to provide a uniform result of reaction, to reduce the destruction that the ultraviolet light causes on the material of alignment layer and the liquid crystal material, and to improve stability of the panel.
Abstract:
The present invention discloses a semiconductor device, which comprises a substrate, a buffer layer on the substrate, an inversely doped isolation layer on the buffer layer, a barrier layer on the inversely doped isolation layer, a channel layer on the barrier layer, a gate stack structure on the channel layer, and source and drain regions at both sides of the gate stack structure, characterized in that the buffer layer and/or the barrier layer and/or the inversely doped isolation layer are formed of SiGe alloys or SiGeSn alloys, and the channel layer is formed of a GeSn alloy. The semiconductor device according to the present invention uses a quantum well structure of SiGe/GeSn/SiGe to restrict transportation of carriers, and it introduces a stress through lattice mis-match to greatly increase the carrier mobility, thus improving the device driving capability so as to be adapted to high-speed and high-frequency application.
Abstract:
The present invention provides to an in-plane-switching (IPS) mode liquid crystal panel, which comprises: a first substrate, a second substrate, a coplanar transparent electrode layer and a liquid crystal layer. The first and second substrates have a first alignment film and a second alignment film, respectively. The coplanar transparent electrode layer is disposed onto the second alignment film. The liquid crystal layer is disposed in a space between the first alignment film of the first substrate and the coplanar transparent electrode layer of the second substrate. The liquid crystal layer comprises dual-frequency liquid crystal molecules and dual-frequency reactive mesogens/monomers. The liquid crystal panel of the present invention can overcome the problems of pollution and static electricity generated from the rubbing alignment in the in-plane-switching (IPS) mode, so as to simplify the manufacturing process and provide the advantages of high contrast, high response speed and wide viewing angle.
Abstract:
The present invention discloses a manufacturing method of an Optically Compensated Bend (OCB) liquid crystal panel, which comprises: an arranging step S1 for alternately arranging a plurality of thin-film transistor (TFT) substrates and a plurality of color filter (CF) substrates, the TFT substrates and the CF substrates are coated with optical alignment material; a light irradiating step S2 for using an ultraviolet (UV) light source to irradiate the TFT substrates and the CF substrates so that alignment films of predetermined alignment directions are formed by the optical alignment material on the TFT substrates and the CF substrates; and an attaching step S3 for attaching each of the TFT substrates and an adjacent one of the CF substrates in such a way that an alignment direction of the TFT substrate is the same as that of the corresponding CF substrate and filling an OCB liquid crystal layer therebetween to form a plurality of OCB liquid crystal panels. For the OCB liquid crystal panel of the present invention, the TFT substrates and the CF substrates are optically aligned in a contactless way, the efficiency of each irradiation is high, which is favorable for mass production.
Abstract:
The invention provides an LCD panel, an LCD device, and a method for manufacturing a panel. The LCD panel includes an upper substrate and a lower substrate which are arranged opposite to each other. Opposite inner sides of the upper substrate and the lower substrate are respectively provided with a layer of alignment film, a sealant is arranged between the upper substrate and the lower substrate, the alignment film is arranged to extend outside the sealant area, and a surface of the alignment film exposed outside the sealant is provided with a sealing layer. In the invention, the alignment film is arranged to extend outside the sealant, which enable a narrow frame to be used to the LCD panel, and improves the utilization rate of the substrate; moreover, the alignment film exposed outside the sealant is sealed, to completely isolate the alignment film from the outside air; thus, the alignment film cannot be hydrolyzed because of absorbing the outside vapor, thereby ensuring the display quality.
Abstract:
The present invention provides a TFT-LCD array substrate having a gate-line metal layer, a data-line metal layer crossing the gate-line metal layer and a plurality of layers covering a periphery of the gate-line metal layer and the data-line metal layer; the gate-line metal layer has first gate lines and second gate lines parallel and alternately arranged, the date-line metal layer has first data lines and second data lines parallel and alternately arranged; the first gate line and the second gate line are electrically connected; the first data line and the second data line are electrically connected. The present invention further provides a manufacturing method of the TFT-LCD array substrate. Implementing the TFT-LCD array substrate and the manufacturing method can reduce the occurrence of line-broken in the active array of TFT-LCD, increase the aperture ratio of the product and enhance yield rate of the products.
Abstract:
A MOS transistor with stacked nanowires and a method of manufacturing the same. The transistor may include a stack of cascaded nanowires extending in a first direction on a substrate; a gate stack extending in a second direction across the nanowire stack; source and drain regions disposed on opposite sides of the gate stack in the second direction; and a channel region constituted of the nanowire stack between the source and drain regions. he cascaded nanowires can be formed by repeated operations of etching back, and lateral etching and then filling of grooves, thereby increasing an effective width of the channel, increasing a total area of an effective conductive section, and thus improving a drive current.
Abstract:
The present invention discloses a semiconductor device, comprising: a substrate, a gate stack structure on the substrate, source and drain regions in the substrate on both sides of the gate stack structure, and a channel region between the source and drain regions in the substrate, characterized in that at least one of the source and drain regions comprises a GeSn alloy. In accordance with the semiconductor device and method for manufacturing the same of the present invention, GeSn stressed source and drain regions with high concentration of Sn is formed by implanting precursors and performing a laser rapid annealing, thus the device carrier mobility of the channel region is effectively enhanced and the device drive capability is further improved.
Abstract:
The present invention discloses a semiconductor device, which comprises a substrate, a buffer layer on the substrate, an inversely doped isolation layer on the buffer layer, a barrier layer on the inversely doped isolation layer, a channel layer on the barrier layer, a gate stack structure on the channel layer, and source and drain regions at both sides of the gate stack structure, characterized in that the buffer layer and/or the barrier layer and/or the inversely doped isolation layer are formed of SiGe alloys or SiGeSn alloys, and the channel layer is formed of a GeSn alloy. The semiconductor device according to the present invention uses a quantum well structure of SiGe/GeSn/SiGe to restrict transportation of carriers, and it introduces a stress through lattice mis-match to greatly increase the carrier mobility, thus improving the device driving capability so as to be adapted to high-speed and high-frequency application.