Invention Grant
US09280510B2 Inter-chip communications with link layer interface and protocol adaptor 有权
与链路层接口和协议适配器的芯片间通信

Inter-chip communications with link layer interface and protocol adaptor
Abstract:
An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
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