发明授权
- 专利标题： Module for ozone cure and post-cure moisture treatment
- 专利标题（中）： 用于臭氧固化和后固化水分处理的模块
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申请号： US13247687申请日： 2011-09-28
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公开(公告)号： US09285168B2公开(公告)日： 2016-03-15
- 发明人: Dmitry Lubomirsky , Jay D. Pinson, II , Kirby H. Floyd , Adib Khan , Shankar Venkataraman
- 申请人： Dmitry Lubomirsky , Jay D. Pinson, II , Kirby H. Floyd , Adib Khan , Shankar Venkataraman
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： F26B25/00
- IPC分类号： F26B25/00 ; H01L21/67 ; H01L21/02 ; H01L21/3105 ; C23C16/40 ; C23C16/56
摘要：
A substrate processing system that has a plurality of deposition chambers, and one or more robotic arms for moving a substrate between one or more of a deposition chamber, load lock holding area, and a curing and treatment module. The substrate curing and treatment module is attached to the load-lock substrate holding area, and may include: The curing chamber for curing a dielectric layer in an atmosphere comprising ozone, and a treatment chamber for treating the cured dielectric layer in an atmosphere comprising water vapor. The chambers may be vertically aligned, have one or more access doors, and may include a heating system to adjust the curing and/or heating chambers between two or more temperatures respectively.
公开/授权文献
- US20120079982A1 MODULE FOR OZONE CURE AND POST-CURE MOISTURE TREATMENT 公开/授权日：2012-04-05
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