Invention Grant
- Patent Title: Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
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Application No.: US14559108Application Date: 2014-12-03
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Publication No.: US09287473B2Publication Date: 2016-03-15
- Inventor: Hidenori Onishi , Shinya Ota , Kazuhiro Fuke
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-175119 20110810
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/56 ; C08L63/00 ; C08G59/20 ; C08G59/42 ; C08K5/06 ; C08K3/22 ; C08K3/36 ; H01L33/62 ; C08L63/06

Abstract:
The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.
Public/Granted literature
- US20150137166A1 EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2015-05-21
Information query
IPC分类: