公开(公告)号：US12012480B2

公开(公告)日：2024-06-18

申请号：US17312167

申请日：2019-11-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuaki Suzuki ,  Shinya Ota

IPC: C08G59/38 ,  G02B6/42

CPC classification number: C08G59/38 ,  G02B6/4212

Abstract: To provide an optical waveguide having excellent adhesive properties with respect to a substrate, an epoxy resin photosensitive composition for an optical waveguide and a photosensitive film for an optical waveguide for fabricating the optical waveguide, and an opto-electric hybrid board including the optical waveguide.

公开(公告)号：US09287473B2

公开(公告)日：2016-03-15

申请号：US14559108

申请日：2014-12-03

Applicant: NITTO DENKO CORPORATION

Inventor： Hidenori Onishi ,  Shinya Ota ,  Kazuhiro Fuke

IPC: H01L33/60 ,  H01L33/56 ,  C08L63/00 ,  C08G59/20 ,  C08G59/42 ,  C08K5/06 ,  C08K3/22 ,  C08K3/36 ,  H01L33/62 ,  C08L63/06

CPC classification number: H01L33/56 ,  C08G59/42 ,  C08K5/06 ,  C08K2003/2241 ,  C08L63/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00 ,  C08L71/02

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

公开(公告)号：US12282200B2

公开(公告)日：2025-04-22

申请号：US17442353

申请日：2020-03-19

Applicant: NITTO DENKO CORPORATION

Inventor： Naoto Konegawa ,  Kazuaki Suzuki ,  Shinya Ota

IPC: G02B6/43 ,  G02B6/12 ,  H01S5/0239

Abstract: An optical element-including opto-electric hybrid board includes an opto-electric hybrid board including an optical waveguide and an electric circuit board in order toward one side in a thickness direction, an optical element mounted on the electric circuit board at one side in the thickness direction of the opto-electric hybrid board, and a bonding member interposed between the optical element and the electric circuit board so as to bond the optical element to the electric circuit board. A thermal expansion coefficient of the bonding member is 80 ppm or less.

公开(公告)号：US20210277173A1

公开(公告)日：2021-09-09

申请号：US17261769

申请日：2019-07-26

Applicant: NITTO DENKO CORPORATION

Inventor： Kazuaki Suzuki ,  Shinya Ota

IPC: C08G59/38 ,  C08G59/32 ,  G02B6/122 ,  H05K1/03 ,  H05K1/02

Abstract: A photosensitive epoxy resin composition for formation of an optical waveguide, which can be used as an optical waveguide forming material excellent in thermal coloration resistance, patternability, and R-to-R adaptability (flexibility in an uncured resin state). The photosensitive epoxy resin composition contains an epoxy resin component and a photo-cationic polymerization initiator, wherein the epoxy resin component comprises an epoxy resin having a tri- or higher functional bisphenol-A skeleton.